Digital Failure Analysis Engineer (R&D)
Quick Summary
Work with Test Engineering, design teams, and Physical Failure Analysis (PFA) laboratories to correlate electrical failure signatures with physical defects and enable defect isolation.
About the Role
~1 min readAs an Electrical Failure Analysis (EFA) Engineer, you will perform various electrical investigative work on defect, performance and design-related issues during the technology development phase pertaining to a broad range of products in order to deliver qual-capable and high-yielding devices. This position also requires the ability to develop testing algorithms to successfully segment various electrical failures. You will also be adhering to all lab safety guidelines.
Responsibilities
~1 min read- →Failure Data Analysis and Diagnosis: Collect and analyze debug data from both internal FA test capability and collaboration with Test Engineering using memory mapping and ATPG diagnostic tools to identify failure signatures and guide root-cause investigation.
- →Electrical Failure Analysis: Perform electrical failure characterization using production and custom test patterns in a bench test environment to isolate failing circuitry and determine defect mechanisms across wafer yield investigations, qualification issues, quality excursions, and customer returns.
- →Cross-Functional Debug and Physical Correlation: Work with Test Engineering, design teams, and Physical Failure Analysis (PFA) laboratories to correlate electrical failure signatures with physical defects and enable defect isolation.
Requirements
~1 min read- Bachelor's degree in Electrical Engineering or Electrical and Computer Engineering
- 5+ years of experience performing electrical failure analysis on semiconductor devices
- Strong understanding of semiconductor fabrication processes
- Excellent technical, communication, and analytical skills
- Experience in interpreting SEM/TEM/FIB/EDS/EELS images and analysis results
- Experience in interpreting scan test data and shmoos
- Familiarity with digital circuit operation and scan-based test methodologies
- Experience using electrical failure analysis techniques such as photon emission analysis, laser-assisted fault isolation, waveform acquisition, or similar FA instrumentation
- Experience with digital IC design, mixed-signal IC design, or related design environments
- Familiarity with memory mapping tools, ATPG diagnostics like Cadence Modus and Synopsys Tetramax and Avalon layouts
- Ability to work collaboratively across engineering teams including design, test, failure analysis, and manufacturing/process development groups
Location & Eligibility
Listing Details
- Posted
- July 16, 2026
- First seen
- July 17, 2026
- Last seen
- July 17, 2026
Posting Health
- Days active
- 0
- Repost count
- 0
- Trust Level
- 51%
- Scored at
- July 17, 2026
Signal breakdown
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