118-WW TMG MFG OPS
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Failure Analysis Engineer

United StatesUnited States·Dallasmid
OtherFailure Analysis Engineer
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Quick Summary

Key Responsibilities

Circuit analysis, bench level equipment skills, die level deprocessing, and report writing; Ability to work from schematic diagrams, written and verbal descriptions,

Requirements Summary

Master’s degree in Electrical Engineering and 2 years of experience in process integration, product development, or failure analysis in semiconductor manufacturing.

Technical Tools
OtherFailure Analysis Engineer

Responsibilities

~1 min read
  • Circuit analysis, bench level equipment skills, die level deprocessing, and report writing; 
  • Ability to work from schematic diagrams, written and verbal descriptions, layouts or defined plans to perform testing, checkout, and trouble-shooting functions; 
  • Perform bench level electrical verification/fault isolation on integrated circuits to determine root cause of failure;
  • Isolate failures for accurate identification of defect locations;
  • Managing the failure analysis process in conjunction with their own skill set development; Work in a team environment and provide consultation for non-F/A disciplines; 
  • Write detailed failure analysis report.

Requirements

~1 min read
  • Master’s degree in Electrical Engineering and 2 years of experience in process integration, product development, or failure analysis in semiconductor manufacturing. OR 
  • Bachelor’s degree in Electrical Engineering and 5 years of experience in process integration, product development, or failure analysis in semiconductor manufacturing.

     

 

Location & Eligibility

Where is the job
Dallas, United States
On-site at the office
Who can apply
US

Listing Details

Posted
June 25, 2026
First seen
June 25, 2026
Last seen
June 26, 2026

Posting Health

Days active
0
Repost count
1
Trust Level
42%
Scored at
June 25, 2026

Signal breakdown

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118-WW TMG MFG OPSFailure Analysis Engineer