Mechanical & Thermal Staff Engineer

Axelera AI is not your regular deep-tech startup. We are creating the next-generation AI platform to support anyone who wants to help advancing humanity and improve the world around us.

In just four years, we have raised a total of $370 million and have built a world-class team of 220+ employees (including 49+ PhDs with more than 40,000 citations), both remotely from 18 different countries and with offices in Belgium, France, Switzerland, Italy, the UK, headquartered at the High Tech Campus in Eindhoven, Netherlands.

We have also launched our Metis™ AI Platform, which achieves a 3-5x increase in efficiency and performance, and have visibility into a strong business pipeline exceeding $100 million.

Our unwavering commitment to innovation has firmly established us as a global industry pioneer.

Are you up for the challenge?

We are looking for a Staff Mechanical & Thermal Engineer to lead the development of cooling solutions for our AI accelerator cards and platforms based on Axelera's processors, targeted at the full spectrum from edge devices to high-performance computing (HPC) platforms. Typical products include PCIe accelerator cards, M.2 form-factor modules, OEM single board computer.

• Lead the design of Axelera's AI accelerator cards and platforms, ensuring mechanical fit and thermal performance from concept to production hand-off, owning both in-house design and the technical management of external suppliers for outsourced cooling solutions.

• Test and validate the cooling solution end-to-end, including thermal simulation, simulation-to-test correlation, lab execution, and characterisation reporting suitable for senior management, suppliers, and customers.

You will own the cooling-solution life-cycle from concept and structured trade-off analysis through validation and production hand-off, in close collaboration with industry partners, OEM customers, and external suppliers.

• Architect cooling solutions across the full technology set: passive heat sinks, heat pipes, vapor chambers, cold plates, and heat spreaders for fanless systems

• Drive make-or-buy decisions; manage in-house design or supplier-outsourced development accordingly

• Run the full CFD cycle (model setup → correlation with test data) from chip to system level

• Lead structured trade-off analysis and arrive at design reviews with clear, evidence-based recommendations

• Partner with PCB and electronics engineers to co-optimise thermal and electrical design from the start

• Define and execute validation plans with documented simulation-to-test correlation

• Run hands-on thermal lab work: chambers, multi-channel DAQ, thermocouples, airflow and power measurements

• Apply DOE methodology to plan campaigns efficiently within constrained test budgets

• Automate measurement workflows and post-processing pipelines in Python

• Produce clear characterisation reports usable by management, suppliers, and customers without further interpretation

• Scout, qualify, and manage cooling suppliers across the full lifecycle: NRE, sample qualification, design freeze, production transfer, quality resolution (8D)

• Maintain project planning in Jira/Confluence and communicate status proactively across functions

• 10+ years in board/system-level mechanical and thermal design for electronics, including HPC-class platforms

• Demonstrated experience with PCIe accelerator cards, M.2 thermal solutions, and fanless embedded systems

• Full ownership of CFD/FEM simulation cycles (FloEFD, Icepak or equivalent)

• High-TDP chip cooling (200 W+), forced-air server integration, heat pipe and vapor chamber design

• Proficiency in 3D CAD (NX, SolidWorks, or similar) and rapid prototyping (3D printing, CNC)

• Python for test automation and data post-processing; comfortable in Linux environments

• Solid grasp of DOE, uncertainty analysis, and simulation-to-test correlation methodologies

• Track record of supplier management including NRE negotiation and quality issue resolution

• Strong communicator — able to deliver concise technical conclusions to senior stakeholders

• Fluent in English; comfortable working across multicultural, distributed teams

• Experience with AI/ML accelerator hardware or high-density edge compute platforms

• Exposure to two-phase cooling, immersion cooling, or cold plate design

• Familiarity with LabVIEW, PyVISA, or version-controlled lab data pipelines

• OEM customer engagement and design-in support experience

Work from our Axelera AI office in Eindhoven (Netherlands). The role requires on-site lab presence for the test and validation activities and is not remote-compatible.