Senior Digital Hardware Design Engineer

At D-Fend Solutions, our people are our greatest strength — and technology is our passion. Our team of innovators and subject matter experts, including veterans of elite military intelligence technology units, is transforming the way organizations protect themselves from drone threats.

As the global leader in cyber-takeover counter-drone technology, we design and deliver advanced, software-defined solutions that empower our customers to detect, take control, and safely land unauthorized drones — with precision and reliability.

Every day, we push the boundaries of innovation to meet real-world security challenges across industries and environments. We’re proud of our cutting-edge technology, our global reach, and the impact we make in securing the skies.

We’re seeking passionate professionals who thrive in a fast-paced, creative, and collaborative environment — those who want to be part of the next generation of airspace security innovation.

Become a D-Fender! Work with the world’s leading cyber-takeover counter-drone technology provider and shape the future of safe airspace.

 

D-Fend Solutions is seeking a talented, high-speed board design expert to own the detailed implementation and industrialization of our next-generation Counter-UAS (C-UAS) processing units.

 

As we scale to a complex, multi-product ecosystem featuring deep multi-sensor fusion, you will actively participate in shaping digital hardware architectures while leading the hands-on engineering from schematic design to mass production.

 

This position demands deep expertise in complex, multi-layer carrier board design specifically utilizing Intel processors and COM Express (COMe) architectures, as well as robust simulation and production methodologies.

Hardware Design Execution: Own the full lifecycle of complex digital hardware boards from schematic capture, component selection, and power distribution network (PDN) design through to high-yield mass production.

Architecture Collaboration: Actively participate in defining the digital hardware architecture, collaborating closely on modular computing strategies, baseboard optimizations, and multi-sensor integration.

Intel & COM Express Integration: Lead the detailed layout and integration of high-performance Intel processors and COM Express (COMe) form factors, managing complex, dense high-speed buses (PCIe Gen 4/5, DDR4/DDR5, 10GbE, USB4).

Simulation & Signal Integrity: Execute rigorous pre- and post-layout Signal Integrity and Power Integrity (SI/PI) simulations to guarantee precise timing margins, stable power delivery, and low-noise performance on dense, fine-pitch BGA footprints.

Production Scale-Up & DFx: Champion Design for Excellence (DFM, DFA, DFT) methodologies, boundary-scan testability, and detailed verification hardware documentation to ensure flawless transfer to manufacturing lines and eliminate field escalations.

Cross-Discipline Collaboration: Work closely with subcontractors (layout) and other R&D disciplines—including FPGA, Embedded SW, Cyber, and Mechanical engineering—to resolve interdisciplinary space, thermal, and noise constraints.