Quick Summary
Ready to make connectivity from space universally accessible, secure and actionable? Then you’ve come to the right place!
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Develop and optimize dry and wet lamination and assembly processes
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Operate lamination processes (hotmelt, adhesives, UV/thermal curing)
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Develop encapsulation and coating stacks
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Select and qualify materials for production
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Apply and optimize protective coatings and encapsulation layers for environmental and mechanical protection.
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Ensure electrical and mechanical robustness of the final product
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Troubleshoot lamination and interconnection defects
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Perform scale-up to production
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Develop SOPs, work instructions, and process documentation for lamination and assembly operations.
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BS or MS in Engineering or related field
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Minimum 5 years of experience in lamination ideally with flexible electronics manufacturing.
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Hands-on experience with thin-film device lamination and encapsulation.
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Experience with flexible substrates and R2R systems
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Familiarity with lamination materials such as adhesives, barrier films, and protective coatings.
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Ability to work closely with production, quality, and equipment teams in a manufacturing environment.
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Experience with UV resistant encapsulation materials.
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Background in lightweight, flexible electronics.
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Familiarity with failure modes related to lamination, delamination, cracking, or interconnect fatigue.
Location & Eligibility
Listing Details
- Posted
- May 29, 2026
- First seen
- May 30, 2026
- Last seen
- May 30, 2026
Posting Health
- Days active
- 0
- Repost count
- 0
- Trust Level
- 67%
- Scored at
- May 30, 2026
Signal breakdown
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