L10/L11 Integration Manufacturing Engineer

Etched is building the world’s first AI inference system purpose-built for transformers - delivering over 10x higher performance and dramatically lower cost and latency than a B200. With Etched ASICs, you can build products that would be impossible with GPUs, like real-time video generation models and extremely deep & parallel chain-of-thought reasoning agents. Backed by hundreds of millions from top-tier investors and staffed by leading engineers, Etched is redefining the infrastructure layer for the fastest growing industry in history.

As an Integration Manufacturing Engineer at Etched, you will own manufacturing integration for our AI systems at the L10/L11 level, ensuring seamless product introduction from prototype through high-volume deployment. This role spans mechanical system integration, rack-level infrastructure, and datacenter deployment readiness across switches, PDUs, CDUs, cabling, racks, and cooling systems. You will work cross-functionally with hardware, electrical, ASIC, thermal, operations, and supply chain teams to drive manufacturability, supplier readiness, yield, scalability, and deployment reliability for Etched’s transformer inference infrastructure.

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  Lead NPI and sustaining engineering activities for L10/L11 system integration, from prototype builds through volume manufacturing and datacenter deployment.

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  Drive Design for Manufacturing (DFM) reviews across mechanical assemblies, rack integration, power distribution, cooling infrastructure, and cabling systems to ensure scalable and cost-effective builds.

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  Partner with suppliers, CMs, ODMs, and infrastructure vendors to qualify new materials, processes, tooling, and integration methods for L10/L11 hardware.

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  Own manufacturing readiness for rack-level systems including switches, PDUs, CDUs, cables, enclosures, and thermal infrastructure.

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  Perform tolerance stack-up analysis, fit checks, DOE/EFA studies, and mechanical validation for complex integrated assemblies.

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  Work closely with hardware and thermal engineering teams to optimize system-level mechanical design for cooling performance, reliability, serviceability, and manufacturability.

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  Develop and validate tooling, fixtures, and manufacturing processes for mechanical subassemblies and final system integration.

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  Drive yield improvement, failure analysis, and cost reduction initiatives through process optimization, supplier engagement, and manufacturing process improvements.

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  Review and influence Process FMEA and Design FMEA activities for integrated mechanical and infrastructure systems.

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  Support supplier capability development, manufacturing scalability planning, and deployment readiness across global manufacturing regions.

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  Collaborate cross-functionally with supply chain, manufacturing operations, and program management teams to align factory readiness with aggressive product schedules and deployment milestones.

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  Provide technical leadership in complex issue resolution involving suppliers, manufacturing partners, and field integration activities.

• Bachelor’s or Master’s degree in Mechanical Engineering, Industrial Engineering, or a related field.

• 7+ years of experience in manufacturing engineering, system integration, or product engineering for datacenter, networking, compute, or AI hardware systems.

• Strong understanding of L10/L11 integration including racks, switches, PDUs, CDUs, cabling, cooling systems, and datacenter infrastructure.

• Proven experience driving enclosure/system builds, thermal integration, and mechanical DFM for high-volume manufacturing.

• Deep knowledge of manufacturing processes including CNC machining, sheet metal, die casting, plastics, cable assemblies, and liquid/air cooling systems.

• Hands-on experience with CAD/CAE tools (Creo, SolidWorks, or similar) and strong GD&T fundamentals.

• Experience working with suppliers, CMs, ODMs, and infrastructure vendors across qualification, ramp, and sustaining activities.

• Strong analytical and problem-solving skills with focus on yield, manufacturability, reliability, and cost optimization.

• Familiarity with process validation, DOE, reliability testing, and failure analysis methodologies.

• Excellent communication and cross-functional collaboration skills in fast-paced hardware development environments.

• Manufacturing and integration of large-scale AI, networking, or datacenter infrastructure systems.

• Supplier cost modeling, should-cost analysis, and total cost of ownership evaluation.

• Scaling global manufacturing operations across Asia, North America, and Europe.

• Thermal infrastructure design including liquid cooling distribution systems and high-density rack integration.

• Long-term capacity planning, deployment scaling, and supply risk mitigation.

• Automation, factory process optimization, or manufacturing test infrastructure development.

• Semiconductor or AI hardware manufacturing environments.

• Working in highly iterative startup environments with aggressive technical and operational timelines.

Etched believes in the Bitter Lesson. We think most of the progress in the AI field has come from using more FLOPs to train and run models, and the best way to get more FLOPs is to build model-specific hardware. Larger and larger training runs encourage companies to consolidate around fewer model architectures, which creates a market for single-model ASICs.

We are a fully in-person team in San Jose and Taipei, and greatly value engineering skills. We do not have boundaries between engineering and research, and we expect all of our technical staff to contribute to both as needed.