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Silicon MEMS Fab Process Development Engineer (Coat/Develop)

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Overview

Silicon MEMS Fab Process Development Engineer (Coat/Develop) Description - What a Fab Process Development Engineer does at HP: * Develop new photo polymer, photo resist coat and ramping up the processes to manufacturing stability.

Technical Tools
project-management
Silicon MEMS Fab Process Development Engineer (Coat/Develop) Description - What a Fab Process Development Engineer does at HP: * Develop new photo polymer, photo resist coat and ramping up the processes to manufacturing stability. * Defining and characterize stable and manufacturable coat/develop process steps, following the product specification through DOE study, to guarantee the best process quality. * Defining, down select and characterize new tooling capability for stable and manufacturable process. * Lead new technology/process transfer from US to Singapore. * Engagement with US development team on process development roadmap. * Lead long term convergence process with US technology development team. * Well versed with latest developments in related technologies/industry. Individuals who do well in this role at HP, usually possess: * Bachelors or Master's degree in Mechanical, Electrical, Electronics, Chemical or Materials Engineering. * Possess at least 3 years of experience in semiconductor wafer fab environment. * Good understanding of semiconductor process Engineering. * In-depth knowledge of cross technical disciplines, analytical skills and problem solving skills with a keen eye to details. * Advanced project management skills including time and risk management, resource prioritization, and project structuring. * Good analytical and problem-solving skills . * High degree of interpersonal skills and able to work both independently and with cross-functional teams. * Able to work under tight timeline and fast pace environment. * Strong communication skills, including written, presentation, negotiation and influencing. * Able to work in cleanroom. Disclaimer This job description describes the general nature and level of work performed in this role. It is not intended to be an exhaustive list of all duties, skills, responsibilities, knowledge, etc. These may be subject to change and additional functions may be assigned as needed by management. #Li-Post Job - Engineering Schedule - Full time Shift - No shift premium (Singapore) Travel - Not Specified Relocation - No Equal Opportunity Employer (EEO) \- HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s). Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence. For more information, review HP’s EEO Policy or read about your rights as an applicant under the law here: “Know Your Rights: Workplace Discrimination is Illegal"

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Listing Details

Posted
May 7, 2026
First seen
May 7, 2026
Last seen
May 7, 2026

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Days active
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Trust Level
51%
Scored at
May 7, 2026

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hpSilicon MEMS Fab Process Development Engineer (Coat/Develop)