ENGINEER, APTD Wafer Thinning / CMP process

Req. ID: JR103823 ENGINEER, APTD Wafer Thinning / CMP process Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1\. Drive improvement in wafer thinning / CMP process performance. 2\. Coordinate experiments for technology development and yield improvement 3\. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4\. Support project on-site execution and make decisions as technical consultant 5\. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6\. Generate internal and external documentation for presentations and technical reports Technology Development 1\. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2\. Engage in process development projects with cross-team interaction, providing expert contribution in materials characterization. 3\. Coordinate mechanical characterization and testing for advanced packaging development efforts globally including US, Japan, and Singapore site. 4\. Provide recommendations for test structure and test vehicle design for material property evaluation. 5\. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technical specifications and roadmaps. Qualifications: 1\. More than 2 years experience in semiconductor related industry 2\. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 3\. Must have one of experiences of Si grinding, Edge Trim, Si CMP, Cu CMP, Oxide CMP technologies 4\. Understanding on the key CMP metrics - Planarity, RR, selectivity, dishing, erosion, surface roughness, and defectivity 5\. Innovative and integration mindset with independent thinking 6\. Good team player with a high motivation 7\. Fluent communication in both English and Chinese Job Profile(s): Product Development Engineer 2 Relocation level: (TBD) Before Getting Started Please review Micron’s Internal Job Application Policy on your regional PeopleNow Career Opportunities page before searching and applying for jobs. Note in particular that: * Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence. * If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process. ​​​​ As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.