Overview
Req ID: JR96415 R&D Thin Films Process Development Engineer Advanced DRAM Our vision is to transform how the world uses information to enrich life for all.
Key Responsibilities
* Technically innovate: Drive strategic, technical, and tactical decisions at a project and platform level by contributing to feasibility studies; Proactively engage technical challenges before they become problems.
Requirements Summary
* 5+ years of experience in semiconductor thin‑film deposition or manufacturing * Experience applying AI, coding, automation, or data science in process development * Proven ability to deliver results through cross‑functional teamwork Job…
Technical Tools
OtherProcess Development Engineer
Req ID:
JR96415 R&D Thin Films Process Development Engineer Advanced DRAM
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Our vision is to transform how the world uses information to enrich life for all!!
We are part of Micron’s Advanced DRAM Technology Development organization, where we push the limits of memory technology every day. Our team works at the intersection of materials science, hardware, and manufacturing to bring next‑generation DRAM devices to life. We collaborate closely, test bold ideas, and move fast to turn innovation into results.
This role is critical to building the thin‑film foundations of advanced DRAM devices. As a Process Development Engineer focused on dielectric deposition, you will own key processes, influence technical direction, and work hands‑on with state‑of‑the‑art tools. You’ll partner across integration, equipment, and operations to deliver robust, scalable solutions that meet aggressive performance and yield goals!
Responsibilities:
* Technically innovate: Drive strategic, technical, and tactical decisions at a project and platform level by contributing to feasibility studies; Proactively engage technical challenges before they become problems. Key processes for this role will be the development/incorporation of new and improved thin films deposition to build High Aspect Ratio Advanced DRAM Features and Devices.
* Operationally Focus: Have the vision and operational understanding to relate on wafer performance to hardware performance, and drive solutions to improve key film metrics like uniformity, conformality, quality, selectivity and electrical or optical performance.
* Impact Results: Lead initiatives to ensure your projects are meeting the technical and operational requirements to ensure program KPI’s.
* Influence: Regularly interact with and lead cross-functional teams to influence technical and strategic decisions; builds strong relationships with the suppliers.
* Skill and experience: Regularly drive project roadmaps, execute to development and maturity timelines, drive meaningful thin-films improvements within the hardware-process space. Deliver meaningful messages to leadership team to communicate status and plans with focus on technical fundamentals and model-based problem solving
Minimum Qualifications:
* Master’s degree with 2+ years of experience in Physics, Chemistry, Chemical Engineering, Materials Science, or related field OR PhD research with relevant industry experience
* Hands‑on experience with thin‑film deposition and process troubleshooting
* Working knowledge of ALD, epitaxy, or plasma‑based deposition fundamentals
* Experience using data‑driven methods such as DOE, SPC, and basic materials characterization
* Ability to work independently and clearly communicate technical results
Preferred Qualifications:
* 5+ years of experience in semiconductor thin‑film deposition or manufacturing
* Experience applying AI, coding, automation, or data science in process development
* Proven ability to deliver results through cross‑functional teamwork
Job Profile(s):
Semiconductor Process Engineer 4
Relocation Level: TBD
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