Sr. Manager, Electrical Engineering

With offices in the U.S. and Germany, MicroVision is a pioneering company in MEMS-based laser beam scanning technology that integrates MEMS, lasers, optics, hardware, algorithms and machine learning software into its proprietary technology to address existing and emerging markets. The Company's integrated approach uses its proprietary technology to provide automotive lidar sensors and solutions for advanced driver-assistance systems (ADAS) and for non-automotive applications including industrial, smart infrastructure and robotics. The Company has been leveraging its experience building augmented reality micro-display engines, interactive display modules, and consumer lidar modules.  

To strengthen our team at the Orlando location, we are looking for a Sr. Manager, Electrical Engineering

The Sr. Manager, Electrical Engineering is a senior engineering leader responsible for guiding and growing the electrical engineering organization supporting MicroVision’s next‑generation automotive LiDAR systems. This role combines people leadership, technical direction, and architectural ownership of complex electronic hardware across the full product lifecycle.

The Sr. Manager will establish clear technical standards, mentor senior engineers, and drive execution from early architecture and safety concept through production release and sustainment. The ideal candidate is a player‑coach with deep experience in automotive electronics, functional safety, and high‑reliability sensing or electro‑optical systems

• →Lead, mentor, and develop a team of electrical engineers spanning senior staff through senior‑level contributors
• →Support hiring, onboarding, and professional development to ensure strong technical coverage across current and future programs
• →Own electrical architecture and technical direction for next‑generation LiDAR electronics
• →Drive electrical design across analog, digital, mixed‑signal, and power domains
• →Establish and enforce robust engineering practices, including WCCA, margin analysis, and design for reliability
• →Provide technical oversight of PCB layout, including stack‑ups, routing strategies, high‑speed interfaces, power integrity, and EMC considerations
• →Oversee schematic symbol, PCB footprint, and component library quality, governance, and lifecycle management
• →Lead and support hardware functional safety activities in accordance with ISO 26262, including FMEDA and DFMEA
• →Serve as the primary electrical engineering interface to automotive OEM and Tier‑1 customers
• →Lead electrical design reviews, respond to customer technical inquiries, and manage customer issue tracking (CIT) items
• →Collaborate closely with systems, firmware, mechanical, optics, manufacturing, and quality teams
• →Ensure electrical designs and documentation are complete, traceable, and aligned with program and customer requirements
• →Serve as a key technical interface between electrical engineering and program leadership

• Bachelor’s degree in Electrical Engineering or related field
• 12+ years of experience in electrical hardware development for complex electronic systems
• 5+ years of experience leading electrical engineering teams or serving as a technical leader on major programs
• Strong background in analog, digital, mixed‑signal, and power electronics
• Experience developing automotive or other safety‑critical electronic systems
• Working knowledge of ISO 26262 functional safety requirements for hardware
• Experience leading or reviewing WCCA, FMEDA, DFMEA, and related reliability or safety analyses
• Proven ability to balance hands‑on technical leadership with people management responsibilities
• Strong written and verbal communication skills across technical and non‑technical audiences

• Master’s degree in Electrical Engineering or related field
• Experience with LiDAR, sensing, imaging, or electro‑optical systems
• Experience with SI/PI analysis tools such as HyperLynx
• Experience supporting products through production launch and sustainment
• Familiarity with automotive OEM or Tier‑1 development processes