Packaging Engineer, Staff

## Company: Qualcomm Semiconductor Limited ## Job Area: Engineering Group, Engineering Group > Packaging Engineering General Summary: Qualcomm Data Center team is developing High performance, Energy efficient server solution for data center applications. We are looking for highly talented, innovative, teamwork-oriented individuals for our cutting-edge technology work! Role and Responsibilities: * Own and drive advanced package selection, new generation product package structure, and configuration optimization. * Responsible for Package/SIP physical design and layout, optimization, DV, and tape out. * Work with multi-functional teams to achieve optimized mechanical, electrical, and thermal performance for various types of chips. * Implement the physical design of packages and modules for SoC. * Interface and coordinate with multi-functional groups throughout Qualcomm on new product package/SiP feasibility analysis, design, and selection. * Define and develop design verification and automation strategy to strengthen and streamline package design and release flows. * Work multi-functionally to optimize package pin out. * Ensure package design is optimized with SI/PI requirements. * Drive methodology, innovations, and efficiency improvements in package design together with vendors and developers on feature development and bug resolution. * Explore, evaluate, and develop new CAD tools, design, and verification flow. * Partner with BU PD team to optimize chip Floorplan and bump placement and optimize the package size. Skills: As the IC Package Design Engineer, you demonstrate fundamental knowledge or proven experience in the following: * Proficient in Cadence APD & SiP and/or Siemens Xpedition Package Designer (xPD). * Familiar in using Constraint Manager in Package design tool for setting up DFM rules and electrical rules * Experience in using in-line DRC checking, DFM verification, Electrical Rule Checking (ERC) preferred. * Basic knowledge in signal-integrity for high-speed IO interfaces, transmission line & electromagnetic field theory. * Knowledge of IC packaging structures, chip-package, and package-board interaction. * Basic knowledge of electronic packaging process and typical failure modes preferred. Preferred Qualifications: * Master's degree in electrical engineering, mechanical engineering, material science, or related fields with 5+ years of experience. * Proven fundamentals in electrical, material, thermal, or mechanical engineering fields. * Familiarity with various sophisticated package configurations and assembly/substrate technology (Flip chip BGA, 2.5D/3D Interposer, etc.). * Experience in package design and proficiency in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP). * Basic understanding of some SI/PI tools (XtractIM, PowerSI, HFSS, Q3D, etc.), package model extraction, S-parameters, and RLGC model. * Basic knowledge of substrate manufacturing process, structure, design rules, and material properties. * Proven understanding of high-speed interfaces, including DDR, PCIe, UCIE, etc. * Experience with Calibre tool and package design reviews. * Knowledge of high-speed layout constraints (crosstalk mitigation, differential pairs). * Solid understanding of Design Rules Check and Design for Manufacturing. Minimum Qualifications: • Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience. OR Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 3+ years of System/Package Design/Technology Engineering or related work experience. OR PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ year of System/Package Design/Technology Engineering or related work experience. Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. 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