Director, System in Package Architecture

At SK hynix America, we are at the forefront of semiconductor innovation. As a global leader in HBM, DRAM, and NAND flash technologies, we develop the advanced memory solutions powering everything from advanced mobile technology to massive AI data centers. With major investments in the U.S. and a leading position in the global AI revolution, we build the critical infrastructure of the digital landscape and remain committed to sustainable operations. We invite innovative minds to be part of our journey. Here, you will be part of a collaborative team pioneering the next generation of memory technologies, expanding our market footprint, and defining the future of computing.

• →Lead the end-to-end development of advanced packaging system architectures to maximize System in Package (SiP) performance, with a specific focus on High Bandwidth Memory (HBM).
• →Drive mechanical and electrical test vehicle design and development when necessary.
• →Spearhead research and development of novel technologies to enhance SiP performance, driving the roadmap for SOC and HBM integration in 2.5D and 3D packaging environments.
• →Lead strategic collaborations with internal teams and external partners to ensure seamless technology development and time-to-market.

• BS in Electrical Engineering or equivalent combination of education and progressive industry experience.
• 7+ years of specialized experience in advanced packaging architecture definition, strategy, and development.
• Demonstrated success in driving cross-functional alignment across engineering, product, and operations teams to deliver complex solutions.
• Proven track record of leading, mentoring, and scaling high-performing engineering teams, with experience managing managers or team leads preferred.
• Exceptional verbal and written communication skills, with the ability to articulate technical strategies.

• Master’s degree or PhD in Electrical Engineering, Materials Science, or related field.
• 10+ years of experience in advanced packaging architecture, specifically with 2.5D and 3D packaging technologies.
• Expert working knowledge of 2.5D/3D packaging technologies and large body substrate technologies.
• Strong proficiency in Signal Integrity (SI) and Power Integrity (PI) analysis and optimization.
• Direct experience in High Bandwidth Memory (HBM) architecture and integration is highly desirable.

SK hynix America is an Equal Employment Opportunity Employer. We provide equal employment opportunities to all qualified applicants and employees and prohibit discrimination and harassment of any type without regard to race, sex, pregnancy, sexual orientation, religion, age, gender identity, national origin, color, protected veteran or disability status, genetic information, or any other status protected under federal, state, or local applicable laws.

In compliance with federal law, SK hynix America also participates in the federal E-Verify program. Upon accepting an offer of employment, all newly hired individuals will be required to complete Form I-9, which includes verifying identity and legal authorization to work in the United States. Please review the official government posters detailing your rights and protections prior to applying:

• E-Verify Participation Poster (Bilingual English & Spanish)
• IER Right to Work Poster (English)
• IER Right to Work Poster (Spanish)