User Terminal Modem RF Engineer

Canada·OttawaFull Time Hire - (FTE with Benefits)mid

OtherRf Engineer

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Telesat (Nasdaq and TSX: TSAT) is a leading global satellite operator, providing reliable and secure satellite-delivered communications solutions worldwide to broadcast, telecommunications, corporate and government customers for over 55 years. Backed by a legacy of engineering excellence, reliability and industry-leading customer service, Telesat has grown to be one of the largest and most successful global satellite operators.

Telesat Lightspeed, our revolutionary Low Earth Orbit (LEO) satellite network, scheduled to begin service in 2027, will revolutionize global broadband connectivity for enterprise and Government users by delivering a combination of high capacity, security, resiliency and affordability with ultra-low latency and fiber-like speeds. Telesat is headquartered in Ottawa, Canada, and has offices and facilities around the world.

The company’s state-of-the-art Satellite fleet consists of 14 GEO satellites, the Canadian payload on ViaSat-1 and one LEO 3 demonstration satellite. For more information, follow Telesat on X and LinkedIn or visit www.telesat.com

We are seeking a mid‑level RF engineer to support the technical management, production readiness, and lifecycle sustainment of an UT Modem/RF module used for DVB operation within the Telesat Lightspeed LEO network.

This role is hands‑on but product‑focused—ideal for an engineer who understands RF hardware deeply, but operates comfortably at the intersection of systems engineering, product and program management, manufacturing, test, and sustaining support. You will act as a technical anchor for the UT Modem/RF module as it transitions from development into qualification, volume production, deployment, and long‑term operational support.

Serve as a technical owner for an RF module supporting DVB‑S/S2/S2X and/or DVB‑RCS2 operation in a LEO satellite network.
Support RF architecture definition and performance budgets (gain, noise figure, linearity, phase noise, spurious emissions).
Ensure RF performance compliance across process, voltage, temperature, aging, and environmental corners.
Support system‑level trade studies and impact assessments when requirements or operating conditions evolve.

Review and approve RF schematics and PCB layouts produced by internal or external design teams.
Ensure adherence to best practices for:

RF grounding and isolation
EMI/EMC mitigation
Shielding and thermal management
Mixed‑signal partitioning
Participate in formal design and readiness reviews (PDR, CDR, MRR), identifying technical risks and proposing mitigation strategies.

Act as the engineering interface to contract manufacturers (CMs), ODMs, and key suppliers.
Lead or support DFM/DFT/DFS reviews, with focus on yield, repeatability, and long‑term producibility.
Define and maintain:

Manufacturing test strategies
Acceptance criteria
Golden units and correlation plans
Support EVT/DVT/PVT builds and production ramp‑up.
Analyze production data (yield, fallout, trends) and drive root‑cause analysis and corrective actions.
Own or support ECO/ECR processes, ensuring controlled and traceable changes throughout the product lifecycle.

Develop, review, and maintain RF, functional, and system‑level test procedures.
Support validation and production testing including:

EVM / MER
ACLR
Phase noise
Harmonics and spurious emissions
DVB waveform compliance
Work closely with system and test teams to ensure requirements traceability and verification completeness.
Support environmental, thermal, and reliability testing aligned with high‑reliability or aerospace practices.

Support embedded control architectures used to configure and monitor RF hardware.
Review and support interfaces such as SPI, I²C, and UART.
Collaborate with firmware teams on:

Board bring‑up
Calibration and compensation routines
Telemetry, health monitoring, and diagnostics
Ensure embedded control supports both manufacturing test and in‑service operation.

Provide ongoing engineering support for deployed hardware, including:

Field issues
Performance anomalies
Failure analysis and returns
Manage component lifecycle risks, including obsolescence and second‑source qualification.
Maintain configuration control, technical documentation, and manufacturing records in PLM systems.
Support long‑term product roadmap considerations, including upgrades and end‑of‑life planning.

B.Sc. in Electrical Engineering or related discipline (M.Sc. preferred).
3–6 years of experience supporting RF hardware in production or operational environments.
Strong understanding of RF components and subsystems (LNAs, mixers, PLLs, PAs, filters).
Experience reviewing RF schematics and PCB layouts, rather than performing layout work.
Familiarity with DVB physical‑layer concepts and performance metrics.
Hands‑on experience supporting test development and automation (e.g., Python/SCPI, LabVIEW).
Demonstrated experience working with manufacturing partners and supporting production issues.
Strong documentation, change management, and cross‑team communication skills.

Experience with LEO satellite systems or user terminals.
Exposure to systems engineering practices (requirements decomposition, verification planning).
Experience working with ODMs or high‑volume CMs.
Familiarity with embedded Linux, Yocto, or board‑level bring‑up support.
Exposure to EMI/EMC compliance or aerospace qualification testing.
Experience sustaining products post‑deployment.
Experience in working with external vendors and Product Management organization

Lifecycle Ownership: Comfortable owning hardware beyond initial design.
Manufacturing Empathy: Designs and decisions informed by production realities.
Systems Thinking: Understands how RF modules fit into larger communication systems.
Execution Focus: Drives issues to closure across organizational boundaries.
Clear Communicator: Effectively interfaces with RF, systems, firmware, test, and suppliers.

This position will be based out of the Ottawa, ON office
Full-time office or hybrid 4 days office/1 day remote, subject to work needs
Working conditions are generally comfortable typical of an office environment.
Combination of lab, manufacturing, and office work.
On‑site presence required for debug, FA, and production support activities.
Occasional travel to manufacturing and UT development partners and test facilities (≈10–15%).
Candidate must be able to obtain relevant security clearance for Canada