Manufacturing Engineer

Responsibilities * Develop, implement, and maintain methods, operating sequences, and processes for the assemblies during start-up for semiconductor equipment. * Lead the development and sustaining of field digitalized start-up procedures (iOMS) for Tier 0 & Tier 1 operations to improve efficiency and consistency. * Allocate tasks to illustrators and oversee progress to ensure timely and high‑quality OMS & DOC deliverables. * Manage BoM integrity across SHPK, MERG, ship-along, SRD, and other configuration sources, ensuring accuracy and alignment with product requirements. * Drive automation initiatives to enhance work proficiency and reduce production and delivery cycle times. * Reduce I&W (installation and warranty) costs by identifying and correcting BoM errors, improving procedures, and lowering field NCs and start-up cycle time through streamlined work processes. * Review field NCs, analyze root causes, and work with corresponding teams develop action plans to prevent recurrence. * Coordinate technical issues, RIT initiatives, and the introduction of new technologies and CIP projects (e.g., 3D OMS) across different business units and cross-functional teams. * Work independently with limited documentation when needed, investigating and compiling data to recommend improvements using established reporting processes. * Collaborate with cross-functional teams to drive complex projects related to quality issues, BoM optimization, and cost reduction. * Interface with engineering teams to support the release of product improvements and new product instructions. * Perform root cause analysis for issues arising during assembly and start-up phases. * Support engineering change requests and partner with design and operations teams to implement changes efficiently for both new and existing products. Requirements Minimum Qualifications * Bachelor’s degree in engineering. * Minimum 4 years of experience working with semiconductor equipment in manufacturing or technical field service. Technical Skills * Hands-on experience with semiconductor process equipment; familiarity with any of the following is an advantage: MDP, EPI, ALD, CMP. * Good understanding of mechanical, digitalization, and automation concepts, with the ability to read and interpret technical drawings and schematics. * Good knowledge of system BoM structure, assembly processes, and procedure documentation. * Proficiency with CAD software (e.g., SolidWorks), CAM tools (e.g., NX), SAP, and MS Office. Professional Competencies * Strong analytical and problem‑solving skills; able to evaluate information and make sound decisions. * Ability to work effectively within standardized processes to meet objectives and deadlines. * Excellent communication skills and the ability to collaborate with multiple stakeholders and cross-functional teams. * Strong independent work ethic and accountability. Other Requirements * Able to work flexibly, including outside standard working hours, to collaborate with stakeholders across different time zones. * Willingness to travel internationally to customer sites (approximately 10%). ## Qualifications ### Education: Bachelor's Degree ### Skills ### Certifications: ### Languages: ### Years of Experience: 4 - 7 Years ### Work Experience: ## Additional Information ### ### Shift: Day (Singapore) ### ### Travel: Yes, 20% of the Time ### ### Relocation Eligible: Yes ### Referral Payment Plan: Employee Referral (Enhanced) Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.