Engineer II, Global Product Support

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  Own assigned products throughout the product lifecycle, from concept and development through alpha, beta, and product release phases.
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  Serve as the system-level product expert across hardware, software, electrical, and process domains.
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  Lead New Product Introduction (NPI) and Continuous Improvement Program (CIP) activities to ensure successful product deployment and operational readiness.
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  Develop test plans, coordinate demo lab activities, and support field implementation readiness for new products and features.
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  Drive Design for Service (DFS) and Design for Install (DFI) initiatives through product design reviews and cross-functional collaboration.
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  Develop, document, and deploy Best Known Methods (BKMs), installation procedures, and operational guidelines to support scalable field execution.
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  Collaborate with engineering, manufacturing, FEMS, and field teams to identify, troubleshoot, and resolve critical product issues.
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  Support product validation, system integration activities, and smooth transitions between alpha and beta development phases.
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  Lead technical taskforces for complex product issues, providing technical direction, escalation management, and stakeholder communication.
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  Drive root cause investigations and corrective actions to improve product performance, reliability, and customer satisfaction.
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  Support global field organizations by providing technical expertise, coaching, and readiness guidance for new product releases.

• Bachelor's degree in Mechanical Engineering, Electrical Engineering, Chemical Engineering, Materials Science, Physics, or a related technical discipline.
• Minimum 4 years of experience in semiconductor equipment engineering, product support, systems engineering, or related technical roles.
• Hands-on experience supporting semiconductor process equipment in development, manufacturing, or field environments.
• Experience leading NPI activities and managing product readiness across multiple functions.
• Strong understanding of system integration involving hardware, software, controls, and process technologies.
• Strong troubleshooting and problem-solving skills with the ability to drive complex technical issues to resolution.
• Ability to effectively communicate technical information across global, cross-functional teams.Fluent English communication skills, both written and spoken.

• Experience supporting ALD, PECVD, CVD, Epi, or other semiconductor deposition technologies.
• Direct experience with system-level troubleshooting of semiconductor capital equipment.
• Knowledge of Design for Service (DFS), Design for Install (DFI), and product lifecycle management principles.
• Experience working in global product support, field engineering, or technical program leadership roles.
• Familiarity with New Product Introduction (NPI) processes in semiconductor equipment organizations.
• Proven ability to lead technical taskforces and influence stakeholders without direct authority.
• Experience supporting customer escalations and driving resolution of high-impact field issues.
• Master's degree in Engineering or a related technical field.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.