Senior Engineer I, Field Process

• →MS degree with relevant internship, research, or academic project experience, or PhD with relevant academic, research, or internship experience in materials science, chemical engineering, or physics.
• →Hands-on experience through internships, research, or academic projects involving processing, developing, or characterizing thin films using thermal ALD, plasma ALD, plasma CVD, epitaxy, or LPCVD reactors.
• →Demonstrated troubleshooting and structured problem-analysis skills gained through internships, lab work, or research projects (e.g., KT, FMEA, Ishikawa, 7-step methodologies).
• →Experience designing, running, and interpreting DOEs or statistical experiments in academic, research, or internship settings.
• →Familiarity with semiconductor device applications, vacuum techniques, metrology, and thin film characterization through coursework, lab work, or internships.
• →Willingness and ability to travel as needed for training and customer engagement; flexibility to support extended hours or weekends during qualifications or escalations.
• →Strong verbal and written communication skills, with the ability to clearly explain technical concepts.
• →Ability to maintain confidentiality and uphold IP boundaries.

• MS degree with relevant internship, research, or academic project experience, or PhD with relevant academic, research, or internship experience in materials science, chemical engineering, or physics.
• Hands-on experience through internships, research, or academic projects involving processing, developing, or characterizing thin films using thermal ALD, plasma ALD, plasma CVD, epitaxy, or LPCVD reactors.
• Demonstrated troubleshooting and structured problem-analysis skills gained through internships, lab work, or research projects (e.g., KT, FMEA, Ishikawa, 7-step methodologies).
• Experience designing, running, and interpreting DOEs and statistical experiments.
• Familiarity with semiconductor device applications, vacuum techniques, metrology, and thin‑film characterization.
• Ability to travel as needed for training and customer engagement; flexibility to support extended hours or weekends during qualifications or escalations.
• Strong verbal and written communication skills, able to explain complex concepts clearly.
• Ability to maintain confidentiality and uphold IP boundaries.

• Internship, research, or academic experience with ASM ALD, PEALD, PECVD, epitaxy, or vertical furnace LPCVD equipment.
• Demonstrated success optimizing deposition processes in research, pilot, or high-volume manufacturing–adjacent environments.
• Exposure to customer-facing technical discussions, presentations, or technical reviews through internships or collaborative research.
• Experience supporting process transfer, scale-up, or qualification activities in academic, pilot, or industrial settings.
• Experience collaborating cross-functionally and contributing to structured action plans during technical challenges or escalations.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.