Senior / Engineer, Process Engineering (Advanced Packaging)

As a Senior / Process Engineer in Advanced Packaging, you will bring your research experience into an industrial R&D environment, contributing to the development of semiconductor process technologies used in next-generation devices. Working closely with experienced engineers and scientists, you will translate scientific insight into scalable, manufacturable solutions. Your work will directly support ASM’s mission to enable the chips that power today’s most advanced technologies.

• →Contribute to the research, development, and optimization of semiconductor processes for Advanced Packaging, including thin-film deposition (ALD, PECVD, PVD, ECP) and surface preparation technologies.
• →Design, execute, and analyze experiments using DOE-based approaches, supported by senior technical experts.
• →Perform materials and process characterization to evaluate film quality, reliability, and performance.
• →Analyze experimental data and clearly document results in technical reports and internal presentations.
• →Collaborate with cross-functional teams across R&D, process engineering, and applications.
• →Support troubleshooting of process or equipment issues in laboratory and pilot environments.
• →Participate in technology reviews and contribute ideas to process improvement and innovation initiatives.
• →Learn industry best practices for transitioning processes from development into customer and manufacturing environments.

• Minimum a Master's degree in Chemical Engineering, Materials Science, Physics, Mechanical Engineering, Electrical Engineering or related field.
• Hands-on research experience with thin-film deposition processes such as ALD, CVD, PECVD, or PVD.
• Strong experimental background, including designing experiments and analyzing complex data sets.
• Solid problem-solving and analytical skills, with a structured approach to research challenges.
• Clear written and verbal communication skills, with the ability to explain technical concepts to diverse audiences.
• Curiosity, initiative, and motivation to apply academic research in an industrial setting.
• Strong understanding of electro/mechanical equipment and software systems

• Research experience related to advanced packaging, interconnects, or semiconductor manufacturing
• Familiarity with statistical methods, DOE tools, or data modeling techniques.
• Experience with materials characterization methods such as SEM, TEM, XRD, or ellipsometry.
• Exposure to cross-disciplinary or collaborative research environments.
• Interest in long-term growth within semiconductor technology development and process engineering.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.