Senior Linux BSP Engineer

Faraday Future (FF) is a California-based mobility company, leveraging the latest technologies and world’s best talent to realize exciting new possibilities in mobility. We’re producing user-centric, technology-first vehicles to establish new paradigms in human-vehicle interaction. We’re not just seeking to change how our cars work – we’re seeking to change the way we drive. At FF, we’re creating something new, something connected, and something with a true global impact.

We are seeking an experienced Senior Linux BSP (Board Support Package) Engineer to lead the development and integration of a new hardware platform based on Qualcomm’s latest Snapdragon Automotive chipset. In this role, you will collaborate with our hardware vendor (who provides the initial Linux bring-up) and take ownership of extending, customizing, and validating the BSP for our specific vehicle configuration. You will enable key peripherals (Display, Camera, Ethernet, Serializer/Deserializer chipsets), integrate with Android Automotive OS, and ensure reliable communication with the vehicle’s on-board MCU for system power management and inter-processor communication. This is a senior-level, hands-on engineering position with significant influence on system architecture, debugging strategies, and technical direction. 

Responsibilities: 

• Lead BSP Development & Board Bring-up 
  • Own the customization of the Linux BSP provided by the hardware vendor. 
  • Guide peripheral bring-up and ensure robust hardware/software integration. 
  • Mentor junior engineers in Linux kernel and driver development. 
• Peripheral Enablement & Integration 
  • Bring up and configure peripherals such as Display, Camera, Ethernet, SerDes chipsets. 
  • Develop, modify, and maintain Linux device drivers for custom hardware. 
  • Validate integration with Android Automotive OS and ensure compliance with vehicle requirements. 
• MCU & Power Management Integration 
  • Design and validate communication with the on-board MCU over SPI/UART/GPIO. 
  • Support power-up, shutdown, suspend/resume sequencing between CPU and MCU. 
  • Ensure reliability in real-world automotive scenarios. 
• Debugging & Validation 
  • Perform in-depth kernel-level debugging using JTAG, serial console, oscilloscope, and logic analyzer. 
  • Define and execute validation procedures for BSP and peripheral bring-up. 
  • Collaborate cross-functionally with hardware vendors, Android application teams, and MCU firmware teams. 

• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related field. 
• 7+ years of experience in embedded Linux BSP development. 
• Proven expertise in Linux kernel, device drivers, and board bring-up. 
• Experience with peripheral bring-up: display (DSI), cameras (CSI), Ethernet, SerDes
• Strong experience with Qualcomm Snapdragon SoCs (automotive or mobile) or other ARM-based SoCs. 
• Proficiency in C/C++, Linux/Android build systems. 
• Hands-on debugging experience with oscilloscope, logic analyzer, JTAG, and serial tools. 
• Understanding of Android Automotive OS HALs and system integration. 
• Strong analytical and problem-solving mindset for complex system-level challenges. 
• Technical leadership with the ability to mentor and guide peers. 
• Effective communicator for cross-functional collaboration and vendor engagement

• Experience with Qualcomm Automotive Development Platforms (ADP). 
• Knowledge of Linux/Android power management frameworks. 
• Prior work on inter-processor communication (SPI/UART/GPIO/I2C) between CPU and MCU. 
• Familiarity with functional safety (ISO 26262), automotive-grade development, and OTA update frameworks. 
• Ability to provide technical leadership across software/hardware integration efforts. 

($135,000 - $160,000 DOE), plus benefits and incentive plans