Senior Signal Integrity Engineer

This is a senior engineering opportunity focused on advancing signal and power integrity solutions for next-generation, high-speed digital interfaces. You will work on advanced hardware systems supporting digital links operating at speeds of up to 448Gbps, combining electromagnetic simulation expertise with practical PCB design knowledge. The role involves analyzing cutting-edge PAM4 and NRZ interfaces, validating simulation results against real-world measurements, and developing robust design practices. You will collaborate closely with PCB layout engineers to optimize signal and power integrity across server, data center, and networking platforms. Your work will directly contribute to the reliability and performance of sophisticated electronic systems. The position also offers an opportunity to influence engineering standards through technical documentation, design guidelines, and best-practice development.

• Minimum 5 years of direct, hands-on experience performing signal integrity simulations for high-speed digital systems.
• Demonstrated proficiency with Ansys HFSS, Cadence Sigrity, PowerSI, Ansys SIwave, and Keysight ADS.
• Strong expertise in high-speed digital interfaces, including PAM4 at 56Gbps and 112Gbps and NRZ at 25Gbps or higher.
• Extensive knowledge of signal integrity and power integrity methodologies, PCB stack-up optimization, impedance control, transmission lines, and PCB fabrication/process constraints.
• Strong understanding of electromagnetic simulation and high-speed interconnect analysis.
• Excellent organizational skills and the ability to produce clear, comprehensive, and technically precise documentation.
• A Master’s degree in Electrical Engineering, Physics, Mathematics, or a related technical discipline, or equivalent professional experience, is preferred.
• 8+ years of experience conducting end-to-end signal and power integrity analysis for high-performance electronic hardware is preferred.
• Experience creating comprehensive design guidelines for ultra-high-speed interconnects and electronic systems is preferred.
• Experience working directly with PCB fabrication vendors to implement and validate complex impedance-controlled board designs is preferred.
• Strong collaboration and communication skills, particularly when working across engineering and hardware development teams.