micron
micron2d ago
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ENGINEER, PACKAGE DEVELOPMENT ENGINEERING, PACKAGE SILICON INTEGRATION

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Req. ID: JR103831 ENGINEER, PACKAGE DEVELOPMENT ENGINEERING, PACKAGE SILICON INTEGRATION Our vision is to transform how the world uses information to enrich life for all.

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Req. ID: JR103831 ENGINEER, PACKAGE DEVELOPMENT ENGINEERING, PACKAGE SILICON INTEGRATION Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. # Engineer Package–Silicon Integration # As an Engineer, Package–Silicon Integration in Micron’s Package Development Engineering (PDE) organization, you will begin your career as a technical contributor supporting NAND package and silicon integration for next‑generation memory products. In this role, you will work closely with experienced engineers across silicon design, wafer fabrication, package design, and assembly teams to learn Micron’s technology development processes, contribute to defined engineering tasks, and support execution of package–silicon integration activities. You will operate with close guidance and mentoring, building foundational technical skills while contributing to team objectives. This position is designed for early‑career engineers and provides structured exposure to semiconductor packaging, integration risks, and cross‑functional collaboration within a high‑volume manufacturing environment. ## Key Responsibilities * Support chip‑package interaction (CPI) assessments by collecting data, performing basic analysis, and documenting results under guidance from senior engineers. * Assist package design, scribe design, and assembly engineers in investigating wafer dicing, singulation, and integration topics. * Participate in DFMEA / PFMEA activities by helping prepare inputs, reviewing risk items, and tracking action items. * Work with wafer fab, R&D, and manufacturing teams to support yield, quality, and manufacturability issue investigations. * Support execution of test vehicles and DOEs, including data collection, basic analysis, and report preparation. * Learn Micron’s package and silicon development flows, design rules, and change‑management processes. * Prepare technical documentation and presentation materials for design reviews, project updates, and knowledge sharing. * Escalate technical issues and risks promptly and seek guidance when encountering unfamiliar problems. ## ## Required Qualifications ### Education & Experience * Bachelor’s or Master’s degree in Engineering (Mechanical, Materials Science, Electrical, Chemical, or related discipline). * < 2 years of relevant experience, including internships, co‑op programs, or research experience in semiconductor, materials, or manufacturing fields. ### ### Technical & Professional Skills * Fundamental understanding of semiconductor manufacturing and/or packaging concepts (coursework or internship level). * Exposure to structured problem‑solving methods (FMEA, DOE, data analysis) through academics or internships. * Ability to follow defined engineering procedures, analyze straightforward technical problems, and learn from feedback. * Strong attention to detail and willingness to learn new tools, processes, and technologies. * Basic proficiency in Microsoft Excel, Word, and PowerPoint for data analysis and documentation. * Good written and verbal communication skills, with the ability to collaborate effectively in a team environment. Job Profile(s): Product Development Engineer 1 - Product Development Engineer 2 Relocation level: (TBD) Before Getting Started Please review Micron’s Internal Job Application Policy on your regional PeopleNow Career Opportunities page before searching and applying for jobs. Note in particular that: * Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence. * If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process. ​​​​ As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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Posted
June 11, 2026
First seen
June 11, 2026
Last seen
June 11, 2026

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Scored at
June 11, 2026

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micronENGINEER, PACKAGE DEVELOPMENT ENGINEERING, PACKAGE SILICON INTEGRATION