Process Integration Lead- IJOP

Req. ID: JR93795 Process Integration Lead- IJOP Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Technical Execution & PI Ownership Lead day‑to‑day Process Integration execution for assigned DRAM modules within the Advanced Technology & Engineering (ATE) organization. Own yield ramp, stability, and integration readiness for assigned scope during technology transfer, pilot, and early HVM phases. Drive root cause investigations for top yield detractors using DOE, SPC/FDC, FMEA, 8D, and structured problem‑solving methodologies. Ensure process window margin, manufacturability, and reliability requirements are met and sustained. Champion adoption of Best‑Known Methods (BKM) and site‑to‑site learning to reduce variability and accelerate learning cycles. Technology Transfer & Ramp Support Execute DRAM technology transfer activities from TD or donor fabs to ID1 under guidance from M2/M3 leadership. Support new product introduction (NPI), process qualification, and customer ramp readiness. Coordinate inter‑fab learning reviews, gap assessments, and corrective action follow‑through. Support extended international assignments (3+ months) for training and technology transfer as required. People Leadership & Coaching Manage and develop a team of Process Integration engineers (NCG and experienced). Provide technical guidance, mentoring, and coaching on PI fundamentals, module ownership, and execution rigor. Set clear priorities, expectations, and deliverables aligned with ramp milestones and fab needs. Conduct regular performance feedback and development planning for direct reports. Foster a culture of accountability, collaboration, safety, and continuous improvement. Cross‑Functional Collaboration Serve as a primary PI interface with Manufacturing, Equipment, Yield Engineering, Device, TD, Quality, and Design teams. Drive alignment and rapid issue resolution across functions to protect yield, schedule, and quality. Communicate status, risks, and mitigation plans clearly to peers and management. Operational Excellence Execute and sustain process control strategies to ensure stable operations during ramp. Ensure compliance with internal quality, safety, and audit requirements. Leverage data and analytics to drive fact‑based decisions and continuous improvement. Support off‑shift or flexible schedules as required during critical ramp phases. Responsibilities: • Lead Process Integration execution and readiness for assigned DRAM modules during tech transfer and early HVM • Drive root cause investigations and yield improvement using DOE, SPC/FDC, FMEA, 8D, and structured problem solving • Ensure process margin, manufacturability, and reliability requirements are met and sustained • Manage and develop a team of PI engineers, providing coaching, priorities, and technical guidance • Partner across Manufacturing, Equipment, Yield, Device, TD, Quality, and Design to drive alignment and resolve issues quickly Minimum Qualifications · Bachelor's degree with a minimum 5 years of HVM or FAB experience -Minimum 3 years of experience in semiconductor fabrication areas such as yield ramp, reduction of cost, and quality improvement. -Clear understanding of transistor operations, scaling limitations and reliability \- Basic knowledge of CMOS and characterization methods Join our dynamic Process Integration team and contribute to the development and optimization of advanced semiconductor processes in a green field FAB environment. This experienced-level role offers hands-on experience in yield improvement, cost reduction, and technology transfer for next-generation devices. You will work in a fast-paced environment, collaborating with cross-functional teams to ensure best-in-class quality and performance. Key Responsibilities Technical Execution & PI Ownership Lead day‑to‑day Process Integration execution for assigned DRAM modules within the Advanced Technology & Engineering (ATE) organization. Own yield ramp, stability, and integration readiness for assigned scope during technology transfer, pilot, and early HVM phases. Drive root cause investigations for top yield detractors using DOE, SPC/FDC, FMEA, 8D, and structured problem‑solving methodologies. Ensure process window margin, manufacturability, and reliability requirements are met and sustained. Champion adoption of Best‑Known Methods (BKM) and site‑to‑site learning to reduce variability and accelerate learning cycles. Technology Transfer & Ramp Support Execute DRAM technology transfer activities from TD or donor fabs to ID1 under guidance from M2/M3 leadership. Support new product introduction (NPI), process qualification, and customer ramp readiness. Coordinate inter‑fab learning reviews, gap assessments, and corrective action follow‑through. Support extended international assignments (3+ months) for training and technology transfer as required. People Leadership & Coaching Manage and develop a team of Process Integration engineers (NCG and experienced). Provide technical guidance, mentoring, and coaching on PI fundamentals, module ownership, and execution rigor. Set clear priorities, expectations, and deliverables aligned with ramp milestones and fab needs. Conduct regular performance feedback and development planning for direct reports. Foster a culture of accountability, collaboration, safety, and continuous improvement. Cross‑Functional Collaboration Serve as a primary PI interface with Manufacturing, Equipment, Yield Engineering, Device, TD, Quality, and Design teams. Drive alignment and rapid issue resolution across functions to protect yield, schedule, and quality. Communicate status, risks, and mitigation plans clearly to peers and management. Operational Excellence Execute and sustain process control strategies to ensure stable operations during ramp. Ensure compliance with internal quality, safety, and audit requirements. Leverage data and analytics to drive fact‑based decisions and continuous improvement. Support off‑shift or flexible schedules as required during critical ramp phases. Responsibilities: • Lead Process Integration execution and readiness for assigned DRAM modules during tech transfer and early HVM • Drive root cause investigations and yield improvement using DOE, SPC/FDC, FMEA, 8D, and structured problem solving • Ensure process margin, manufacturability, and reliability requirements are met and sustained • Manage and develop a team of PI engineers, providing coaching, priorities, and technical guidance • Partner across Manufacturing, Equipment, Yield, Device, TD, Quality, and Design to drive alignment and resolve issues quickly Minimum Qualifications · Bachelor's degree with a minimum 5 years of HVM or FAB experience -Minimum 3 years of experience in semiconductor fabrication areas such as yield ramp, reduction of cost, and quality improvement. -Clear understanding of transistor operations, scaling limitations and reliability \- Basic knowledge of CMOS and characterization methods Preferred Qualifications -Master's or Ph.D. degree in Material science, Electrical, Electronics, Chemical or Engineering areas -Experience with TD, Process Integration, Device, Yield analysis, QR -Experience working with 300mm semiconductor environment. -Solid knowledge of tech transfer and development -Experience in SWR, process transfer, module ownership, ramp up, trend sustaining Core Competencies -Strong analytical and problem-solving skills. -Effective communication and teamwork. -Ability to work in a fast-paced, time-sensitive environment. -Respect for diversity and inclusion. Job Profile(s): Semiconductor Process Engineer 3 - Semiconductor Process Engineer 4 Relocation level: (TBD) Before Getting Started Please review Micron’s Internal Job Application Policy on your regional PeopleNow Career Opportunities page before searching and applying for jobs. Note in particular that: * Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence. * If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process. ​​​​ As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.