Senior Engineer, Staff / Manager (Wet Etch/Electroplating)

## Company: RF360 Singapore Pte., Ltd. ## Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: • Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. Job Responsibilities: * Lead and manage a wafer fab manufacturing engineering module specializing in Wet Etch and Electroplating processes * Manage and develop a team of engineers and technicians in a high‑volume manufacturing environment * Drive excellence in output, quality, cost, equipment uptime, and safety * Ensure robust process control, stability, and integration across wet etch and plating operations * Lead root‑cause investigations for process, quality, and equipment issues and drive permanent corrective actions * Drive yield improvement, scrap reduction, and defect reduction through data‑driven analysis * Ensure high equipment availability and reliability, particularly for wet benches and plating tools * Apply and sustain SPC and statistical analysis tools to monitor and improve process performance * Actively contribute to continuous improvement programs to resolve chronic manufacturing or quality issues * Work closely with cross‑functional teams including Process Integration, Equipment, Quality, and Manufacturing * Provide technical and operational leadership during crisis situations impacting fab operations * Ensure strict compliance with EHS requirements, quality systems, cleanroom discipline, and wafer fab protocols ## ## Job Requirements * Bachelor’s degree in Engineering, Chemistry, Materials Science, Physics, or related discipline * Minimum 10 years of relevant experience in semiconductor wafer fabrication * Strong hands‑on technical expertise in Wet Etch, Electroplating, and related wet processes * Prior experience in high‑volume semiconductor manufacturing within an MNC environment * Strong understanding of: * Process integration * Statistical Process Control (SPC) * Yield improvement and scrap reduction methodologies * Equipment maintenance strategies, particularly for wet benches and plating tools * Proven people management experience, including coaching, talent development, succession planning, and manpower deployment * Demonstrated ability to lead root‑cause analysis and corrective action implementation * Strong sense of ownership with the ability to work effectively under pressure * Hands‑on leadership style with strong problem‑solving and decision‑making capabilities * Excellent communication and cross‑functional collaboration skills * Familiarity with statistical analysis tools, Excel, PowerPoint, and Word * Strong commitment to Environmental Health & Safety (EHS), quality systems, and fab compliance Qualcomm is an equal opportunity employer. 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