Electromechanical Packaging Engineer

Red Cell Partners is an incubation firm building and investing in rapidly scalable technology-led companies that are bringing revolutionary advancements to market in three distinct practice areas: healthcare, cyber, and national security. United by a shared sense of duty and deep belief in the power of innovation, Red Cell is developing powerful tools and solutions to address our Nation’s most pressing problems.

We are open-minded, fast paced, problem solvers that value open dialogue and candor. Our passion is to challenge the status-quo and we embrace transformational thinking.  Our response is never “no, but….” instead “yes, if….”.  We are mindful of our personal and organizational blinders and try to build an environment where our team members are At Their Best.

• →Minimum BS in Mechanical or Electrical engineering, MS or higher-level degree preferred. 
• →5+ years’ experience with microelectronics packaging, and/or PCB design
• →Knowledge of foundry processes and chip scale assembly processes
• →Understanding of how electrical design requirements impact substrate layout and interconnect selection
• →Proficient with 3D mechanical CAD software (Creo, NX, Catia, etc.), generating mechanical drawings, and GD&T
• →Ability to read and create electrical schematics
• →Familiarity with tape out processes for wafers and substrate 
• →Basic understanding of Form, Fit, Function elements in design for manufacturability (DFM).
• →willingness to learn new concepts and techniques and concepts
• →Familiarity with PCB design tools (Altium, Cadence, Mentor, etc.) is a plus
• →Basic understanding of component level thermal analysis is a plus
• →Willingness to be in the office in Torrance, CA a minimum of 3 days per week