LFAB Cu Plating Process Engineer

United States·Lehimid

EngineeringProcess Engineer

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Quick Summary

Key Responsibilities

Join the team of dynamic engineers that work on process sustenance,

Requirements Summary

3 years of experience within the Semiconductor industry within Electroplating/Plating. Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering,

Technical Tools

EngineeringProcess Engineer

Responsibilities

~1 min read

→Join the team of dynamic engineers that work on process sustenance, development and transfer
→Support manufacturing operations
→Perform lot and equipment dispositions to support the continuous flow of production and to minimize cycle time in a high volume manufacturing 300mm wafer Fab running Analog Technologies
→Support the manufacturing ramp with execution of equipment/process startup, process experiments (SWRs)
→Develop and implement improved methods of manufacturing, procedures, and processes that result in improved efficiencies, yields, machine operations, and quality
→Implement project or improvement plans for areas of responsibility including but not limited to: efficiency improvements, cost reduction or quality improvement programs, new product support and other process improvements
→Perform lot and equipment dispositions to support the continuous flow of production and to minimize cycle time in a high volume manufacturing 300mm wafer Fab running Analog Technologies
→Identify systematic problems in either process or equipment related sources and communicating findings to the engineering staff in a continuous manner
→Support the manufacturing ramp with execution of equipment/process startup, process experiments (SWRs)
→Participate in data analysis and problem resolution
→Support 28nm CMOS Planar technology

Requirements

~1 min read

3 years of experience within the Semiconductor industry within Electroplating/Plating.
Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related engineering field
Strong foundation in statistical process control, engineering change control and process release strategies

Experience with Cu Plating and Cu Barrier Seed.
BEOL process integration experience
Demonstrated strong analytical and problem solving skills
Ability to adapt and be dynamic
Ability to work effectively in a fast-paced and rapidly changing environment
Ability to take the initiative and drive for result
Demonstrated ability to build strong, influential relationships
Strong verbal and written communication skills
Ability to work in teams and collaborate effectively with people in different functions
Strong time management skills that enable on-time project delivery