Packaging Engineering Manager

The Emerging Packaging and Test Team at Texas Instruments is looking for a qualified candidate 

• To lead a high-performing team of packaging technologists to define, design, develop and scale to volume production high voltage (200-3300V) packages and high power modules for the Industrial, Automotive, Renewable and Telecom markets.
• The candidate must understand market trends & end equipment system requirements and build these into competitive forward-looking package and module roadmaps 
• The candidate must have the ability to define solutions across various HV technologies like GaN, SiC, IGBT and Isolation Technologies and validate these using CFD, thermomechanical and electrical parasitic extraction tools.
• The candidate will identify prototype/subcon partners, assess manufacturing capabilities and drive completion of 1^st article builds. The candidate must also be capable of developing new process flows/technologies necessary for scaling to high volume manufacturing 
• The candidate should outline the package reliability plans, complete testing, summarize failure modes and provide solutions to address issues.
• The candidate must have a broad knowledge of the material supplier landscape (mold compounds, die attach, substrates) for high voltage applications as well as  process / equipment integration and must work with various suppliers to provide solutions to meet TI roadmaps 
• The candidate must be a proven leader and people manager, capable working collaboratively across worldwide cross functional teams and capable of accelerating development cycles and ensuring rapid time-to market for new products.

• BS degree in Mechanical, Material Sciences, Electrical Engineering or related engineering degree
• 10+ years of experience and proven track record of innovation in High Voltage (200V-3300V must) and high power (5KW – 300KW) semiconductor packaging across GaN / SIC / IGBT, Super Junction MOSFET technologies. 
• Excellent communication skills and ability to work with internal and external customers to define and develop roadmaps.
• Hands on high voltage package and power module design, materials, equipment, and assembly flow integration (molded packages like TOLT, TOLG, Q-DPAK  DIP, SIP and case modules). 
• Prior experience scaling HV packages and modules from concept to high volume manufacturing. 
• Good understanding of clip attach, flip chip packaging and overview of wafer bumping processes 
• Strong knowledge of HV Bill of Materials (Mold compounds, Die Attach, DBC substrates etc.).
• Good understanding of industry & subcon HV packaging capabilities & roadmaps.
• Strong knowledge of Silicon / GaN / SiC-package interaction and hands on experience with stress, thermal and electrical modeling analysis and tools.
• Overview of high voltage discrete and power modules reliability and qualification requirements, proven ability to define and drive reliability and qualification strategies in alignment with these standards and problem solving
• Track record of presenting at international conferences or symposiums related to power electronics, semiconductor packaging, or high-voltage technologies.
• Proficiency in English and Japanese