Engineer I, Manufacturing Engineering
Quick Summary
Step into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what’s next,
Responsibilities
~1 min read- →Partner with the Global Operations (GOPS) team (Manufacturing, Production Planning, Procurement, and Quality Engineering) with emphasis on manufacturing processes, cycle time, assembly/test sequence, and quality.
- →Provide first line engineering support in resolving daily operation issues in semiconductor equipment manufacturing, through collaboration with a team of multidisciplined manufacturing engineers, manufacturing supervisors and technicians.
- →Achieve daily targets on product delivery to global customers in alignment with manufacturing engineering strategies, production schedules, quality and safety standards.
- →Perform systematic troubleshooting and root cause analysis of manufacturing issues and deviations, provide immediate containment actions, and pursue long term corrective solutions.
- →Define and create manufacturing procedures, build/test sequence, methods, and quality documentation (i.e. work instructions, test procedures, inspection checklists, etc.) according to material and assembly specifications.
- →Drive timely solutions for the suppliers, contract manufacturing, and internal manufacturing by liaising with cross functional teams in GOPS and Business Units (BU).
- →Lead the execution of continuous improvement projects on quality, cost, capacity, and efficiency enhancement with cross functional teams in GOPS and BU.
- →Deliver tooling and test equipment according to product requirements, with innovations in meeting manufacturing efficiency and customer quality.
- Minimum Bachelor’s Degree in Electrical/Electronic/Mechatronics or related disciplines
- Minimum 1 year of experience working in a manufacturing or engineering environment with hands-on engagement on manufacturing and productivity activities.
- Experience within the Semiconductor/Capital Equipment industry in Manufacturing, Quality and/or engineering roles in equipment assembly and test
- Knowledge on material fabrication processes, component installation, sub-assembly and final assembly integration for ALD equipment
- Understanding on Bill of Material structure (Product structure, Generic vs. Customization, Options and Kits) and revision changes
- Experience in working and interfacing with cross functional teams. Demonstrated ability to influence cross functional organization and drive changes.
- Familiar with the following operational excellence tools but not limited to: Lean Manufacturing, FMEA, 8D, PDCA, DMAIC, 6-sigma, Cpk, GR&R and SPC.
- Experience in New Product Introduction or technology transfer
- Experience with Teamcenter, SAP and/or major ERP/MRP systems and processes at user level
- Comfort working in fast‑paced manufacturing environments with shifting priorities
- A curious, proactive mindset with a strong desire to learn and grow as an engineer
- Clear communication skills and confidence engaging with technicians, engineers, and cross‑functional partners
We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.
To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.
ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.
Location & Eligibility
Listing Details
- Posted
- June 5, 2026
- First seen
- June 5, 2026
- Last seen
- June 5, 2026
Posting Health
- Days active
- 0
- Repost count
- 1
- Trust Level
- 61%
- Scored at
- June 5, 2026
Signal breakdown
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