Senior Engineer, Field Process

• →Support New Product Introduction (NPI) by training with the Business Unit to gain expertise in new deposition processes and hardware.
• →Lead the introduction and transfer of new processes to the customer site.
• →Partner closely with field hardware engineers and Business Unit teams to troubleshoot new products and develop proposals for process or hardware improvements.
• →Design and execute on-site experiments with the customer, driving development, integration, and continuous improvement projects.
• →Escalate issues in a timely manner to maintain project scope, timelines, and customer alignment.
• →Document key learnings during NPI and ensure effective knowledge transfer to local service and manufacturing teams.
• →Analyze baseline system and process performance to identify gaps relative to technology‑node requirements.
• →Perform structured problem‑solving and root‑cause analysis on process or system nonconformances.
• →Collaborate with customer teams to identify and grow opportunities for ASM hardware and process adoption.
• →Support process transfer to high‑volume manufacturing (HVM) fabs, creating and sharing best‑known methods (BKMs) and documentation.
• →Maintain strong discipline in IP boundaries, customer communication, and escalation leadership.

• MS degree with relevant internship, research, or academic project experience, or PhD with relevant academic, research, or internship experience in materials science, chemical engineering, or physics.
• Hands-on experience through internships, research, or academic projects involving processing, developing, or characterizing thin films using thermal ALD, plasma ALD, plasma CVD, epitaxy, or LPCVD reactors.
• Demonstrated troubleshooting and structured problem-analysis skills gained through internships, lab work, or research projects (e.g., KT, FMEA, Ishikawa, 7-step methodologies).
• Experience designing, running, and interpreting DOEs and statistical experiments.
• Familiarity with semiconductor device applications, vacuum techniques, metrology, and thin‑film characterization.
• Ability to travel as needed for training and customer engagement; flexibility to support extended hours or weekends during qualifications or escalations.
• Strong verbal and written communication skills, able to explain complex concepts clearly.
• Ability to maintain confidentiality and uphold IP boundaries.

Additionally, you will be required to travel 50-70% of the time for the first year, for training purposes (Asia, Europe or United States)

• Internship, research, or academic experience with ASM ALD, PEALD, PECVD, epitaxy, or vertical furnace LPCVD equipment.
• Demonstrated success optimizing deposition processes in research, pilot, or high-volume manufacturing–adjacent environments.
• Exposure to customer-facing technical discussions, presentations, or technical reviews through internships or collaborative research.
• Experience supporting process transfer, scale-up, or qualification activities in academic, pilot, or industrial settings.
• Experience collaborating cross-functionally and contributing to structured action plans during technical challenges or escalations.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.