Lead Mechanical Engineer – AI Data Centers

An innovative AI data center startup is redefining the future of computer infrastructure to support the exponential growth of artificial intelligence, machine learning, and high-performance computing. To power these advanced workloads, the company is seeking a Lead Mechanical Engineer – AI Data Centers to design and scale state-of-the-art thermal management solutions, including direct liquid-to-chip cooling and next-generation mechanical systems.

This is a rare opportunity to lead the design of mission-critical cooling systems at the forefront of global AI infrastructure, with full ownership of mechanical strategy across a rapidly growing portfolio of ultra-dense data centers.

• Competitive compensation and performance-based incentives.
• Fully remote flexibility with occasional travel to project sites and partner facilities.
• Leadership role in designing the next generation of AI infrastructure at a global scale.
• Access to significant capital resources and backing to execute cutting-edge projects.
• Collaborative, forward-thinking startup culture with high visibility and long-term growth opportunities.

• Lead the full mechanical design and engineering of AI-optimized data centers utilizing next-generation cooling solutions, including direct liquid-to-chip cooling, immersion cooling, and hybrid systems.
• Architect highly efficient thermal management systems to support extremely high rack densities, GPU-intensive workloads, and rapid deployment models.
• Collaborate with cross-functional teams including electrical, controls, networking, IT operations, and facility construction to deliver integrated solutions.
• Evaluate, select, and implement cutting-edge technologies in heat rejection, fluid distribution, and advanced materials for maximum system efficiency and reliability.
• Manage partnerships with vendors, OEMs, contractors, and commissioning teams to deliver projects on time and within budget.
• Develop and enforce mechanical engineering standards, design guides, operating procedures, and commissioning protocols for scalable deployment across global sites.
• Analyze system performance, conduct failure mode analysis, and drive continuous optimization for uptime, efficiency, and resiliency.
• Lead innovation efforts to incorporate modular, sustainable, and energy-efficient mechanical designs.

• 10+ years of mechanical engineering experience in data centers, semiconductor fabs, high-density compute, or mission-critical facilities.
• Proven expertise designing and implementing advanced cooling technologies, including liquid-to-chip, cold plate, immersion cooling, or hybrid cooling systems.
• Deep knowledge of thermodynamics, fluid dynamics, heat transfer, and phase change technologies.
• Experience with high-density AI/ML workloads, GPU compute clusters, or HPC environments.
• Familiarity with codes and standards including ASHRAE, Uptime Institute, ANSI, NFPA, and relevant international standards.
• Skilled in simulation tools such as CFD (Computational Fluid Dynamics) modeling and thermal performance analysis.
• Ability to lead teams through all project phases from concept design through commissioning and operational handover.
• Bachelor’s degree in Mechanical Engineering required. PE license strongly preferred.

• Experience designing mechanical infrastructure to support rack power densities exceeding 120kW.
• Exposure to modular and prefabricated data center design models.
• Familiarity with advanced water treatment systems, energy recovery systems, and low-pue design targets.
• Master’s degree or advanced technical certifications a plus.

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