Mechanical Engineer

We are seeking a Mechanical Engineer to join our team, specializing in mechanical simulations for semiconductor packages. The ideal candidate will have a background in predicting stress and mechanical behavior across various layers of both advanced 2.5D and standard semiconductor packages. You will be a part of a high-impact high-visibility team, and you will learn about all aspects of AI hardware development, from architecture to design to manufacturing, to reliability.

This role is hybrid, based out of Toronto, ON.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

• You hold a degree in Mechanical Engineering, Materials Science, or a related field and have experience in semiconductor package simulation.
• You bring strong expertise in stress analysis, thermal behavior, and mechanical modeling for complex package structures.
• You are proficient with FEA tools such as ANSYS, Abaqus, or similar platforms, with a solid foundation in core mechanical engineering principles.
• You work independently, build models from scratch, gather input across teams, and communicate technical findings clearly to stakeholders.

• Perform mechanical simulations to predict stress, strain, and thermal behavior across semiconductor packages, including ELK layer, ubump, bump, C4 bump, and BGA.
• Conduct warpage prediction and mechanical optimization to improve manufacturability, reliability, and overall package performance.
• Analyze and validate multiple package design options under a range of operating conditions using robust simulation models.
• Collaborate with design, process, and reliability teams while documenting and presenting simulation results to stakeholders.

• →You will gain exposure to the full AI hardware development lifecycle, from architecture and design through manufacturing and reliability.
• →You will deepen your understanding of advanced semiconductor packaging technologies, including 2.5D integration.
• →You will see how simulation directly shapes package design decisions, product performance, and readiness for production.
• →You will broaden your perspective by working cross-functionally with experts across packaging, design, process, and reliability.

Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.