Analog IC Design Engineering Intern

ChinaChina·Shanghaientry
OtherDesign Engineering Intern
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Quick Summary

Requirements Summary

Currently pursuing an undergraduate or graduate degree in Electrical Engineering, Computer Engineering or Electrical & Computer Engineering Cumulative 3.0/4.

Technical Tools
OtherDesign Engineering Intern

Responsibilities

~1 min read
  • →Partnering with business teams and system engineering to develop mutually agreeable design specifications 
  • →Providing high-level analysis on chip architecture trade-offs to ensure spec compliance and superior performance at a competitive cost 
  • →Participating in design reviews and creating the necessary design and product documentation 
  • →Supervising IC layouts to ensure a high-performance standard 
  • →Characterizing prototypes, developing test specifications and coordinating with test/product engineering to drive product releases 
  • →Driving behavioral models 

Put your talent to work with us as a Design Engineer Intern! 

Minimum requirements:

  • →Currently pursuing an undergraduate or graduate degree in Electrical Engineering, Computer Engineering or Electrical & Computer Engineering
  • →Cumulative 3.0/4.0 GPA or higher

Requirements

~1 min read
  • Ability to establish strong relationships with key stakeholders critical to success, both internally and externally
  • Strong verbal and written communication skills
  • Ability to quickly ramp on new systems and processes
  • Demonstrated strong interpersonal, analytical and problem-solving skills
  • Ability to work in teams and collaborate effectively with people in different functions
  • Ability to take the initiative and drive for results
  • Strong time management skills that enable on-time project delivery

Location & Eligibility

Where is the job
Shanghai, China
On-site at the office
Who can apply
CN

Listing Details

Posted
February 17, 2025
First seen
September 26, 2026
Last seen
September 26, 2026

Posting Health

Days active
0
Repost count
0
Trust Level
16%
Scored at
September 26, 2026

Signal breakdown

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118-WW TMG MFG OPSAnalog IC Design Engineering Intern