BEOL Process Integration Engineer (R&D)

We’re at the forefront of an exciting era of semiconductor innovation at Texas Instruments’ LFAB in Lehi, Utah home to our state-of-the-art 300mm manufacturing facility now ramping our most advanced 28nm analog and embedded process technology in the heart of the Silicon Slopes. As part of our Advanced Technology Development (ATD) organization, you won’t just support production you’ll create the technology that makes it possible. From developing the Resolution Enhancement Techniques and OPC models that enable 28nm lithographic patterning, to engineering the precision wet process chemistries that define device performance at atomic scale, ATD engineers are solving the hardest problems in analog semiconductor development. At full production, our fabs will manufacture tens of millions of analog and embedded processing chips every day  built on the process technologies you help create and qualify. We’re committed to responsible, sustainable manufacturing and making a meaningful impact on the local community through job creation and substantial investments in K–12 STEM education. In this role, you’ll work at the intersection of fundamental research and high-volume manufacturing, turning process innovations into production-ready technologies that power electronics everywhere.

Texas Instruments is seeking a BEOL Process Integration Engineer.  In this role, you will drive the integration and development of the overall BEOL in advanced lithography nodes, such as 28/22nm and beyond. 

• →Ownership of the process flow for BEOL that meets physical, electrical, yield and reliability targets
• →Working closely with the unit process development group to design experiments to evaluate multiple integration options and arrive at an optimized, manufacturable and cost-effective solution
• →Partnering with the RET team to validate OPC and make improvements, as appropriate
• →

  Collaborating with the silicon-package-test interaction (SPTI) team to ensure silicon process is compatible with test and packaging robustness requirements

  As part of this role, you will be accountable for delivering technology solutions on time that meet product requirements.

The person performing this role must be capable to plan effectively, drive schedules, meet critical deadlines on multiple tasks in parallel, lead technical discussions in their area of expertise, and work effectively across organizational boundaries. They must be able to clearly communicate project status and actions. Additionally, they must be able to interface with multiple organizations and work well on a diverse team to accomplish goals.

• Master’s degree in Electrical Engineering, Materials Science & Engineering, or related degree
• 5+ years of experience in 28nm & below technology with hands-on experience developing BEOL
• Demonstrated experience and ability to plan effectively, drive schedules, meet critical deadlines on multiple tasks in parallel, lead technical discussions in their area of expertise, and work effectively across organizational boundaries

• Ph.D. degree in Electrical Engineering, Materials Science & Engineering, or related degree
• Experience with 28/22nm technology development for BEOL including RRAM (Resistive Random Access Memory), TFR (Thin Film Resistor), MIMCAP (Metal-Insulator-Metal Capacitor), if possible
• Ability to establish strong relationships with key stakeholders critical to success, both internally and externally
• Strong verbal and written communication skills
• Ability to quickly ramp on new systems and processes
• Demonstrated strong interpersonal, analytical and problem-solving skills
• Ability to work in teams and collaborate effectively with people in different functions
• Ability to take the initiative and drive for results
• Strong time management skills that enable on-time project delivery