Career Accelerator Program - Packaging Engineer
United States·DallasmidOtherPackaging Engineer
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Quick Summary
Key Responsibilities
Partner with the businesses to design and develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules,
Technical Tools
OtherPackaging Engineer
Responsibilities
~1 min read- →Bachelors degree in Material Science, Mechanical Engineering, Chemical Engineering, Physics, Electrical Engineering or related
- →Cumulative 3.0/4.0 GPA or higher
Requirements
~1 min read- Basic understanding of statistical process control (SPC)
- Semiconductor packaging knowledge is preferred (manufacturing processes, assembly, reliability, materials, characterization, FA)
- Demonstrated analytical and problem solving skills
- Strong written and verbal communication skills
- Ability to work in teams and collaborate effectively with people in different functions
- Strong time management skills that enable on-time project delivery
- Ability to build strong, influential relationships
- Ability to work effectively in a fast-paced and rapidly changing environment
- Ability to take the initiative and drive for results
Texas Instruments will not sponsor job applicants for visas or work authorization for this position.
Location & Eligibility
Where is the job
Dallas, United States
On-site at the office
Who can apply
US
Listing Details
- Posted
- September 11, 2026
- First seen
- September 25, 2026
- Last seen
- October 1, 2026
Posting Health
- Days active
- 5
- Repost count
- 0
- Trust Level
- 24%
- Scored at
- October 1, 2026
Signal breakdown
freshnesssource trustcontent trustemployer trust
External application
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