Die Prep Equipment Engineer (MES Project)
Quick Summary
MES Implementation (Project Phase): Represent Die Prep equipment engineering in the MES rollout. Define workflows, setup/recipe controls, and equipment states.
Validate integration scenarios and support UAT and deployment.
Join TI as a specialized Equipment Engineer to drive the digital transformation of our Die Prep lines. This is a unique, multi-phase role: following a 1 month TI orientation familiarizing with TI systems while being deployed into a critical MES implementation project team for 1–2 years. Upon successful project completion, you will transition into a production role, utilizing your deep MES expertise to optimize equipment uptime and automation in a high-volume manufacturing environment.
Responsibilities
~1 min read- →MES Implementation (Project Phase): Represent Die Prep equipment engineering in the MES rollout. Define workflows, setup/recipe controls, and equipment states.
- →Integration & Data: Translate Die Prep hardware requirements (e.g., dicing/sawing mechanics) into digital designs. Define data collection points for equipment health and interlock logic.
- →Validation: Validate integration scenarios and support UAT and deployment.
- →Sustaining (Post-Project Phase): Transition to production to maintain Die Prep equipment reliability and leverage MES data for predictive maintenance and automation.
Requirements
~1 min read- Minimum Education (Bachelor's degree Electrical Engineering, Electrical Computer Engineering, Chemical Engineering, Mechanical Engineering, Materials Science Engineering,) Physics or related engineering degree
- Strong hands-on semiconductor equipment experience in Die Prep/Dicing equipment, with minimum 2 years of relevant experience
- Equipment experience with Backgrind, Mechanical Saw, Laser Saw are welcome
- Candidate with MES experiences
- Experience on tool monitoring and interdiction software, and equipment maintenance and documentation
- Working knowledge of semiconductor manufacturing, and SPC techniques. Experienced with semiconductor cleanroom protocol and behaviors.
- Strong verbal and written communication skills
- Demonstrated strong analytical, critical thinking and problem solving skills
- Ability to work in teams and collaborate effectively with people in different functions
- Ability to take the initiative and drive for results
- Strong time management skills that enable on-time project delivery
- Ability to work effectively in an interrupt-driven, fast-paced and rapidly changing environment
- Demonstrated ability to build strong, influential relationship
Location & Eligibility
Listing Details
- Posted
- September 28, 2026
- First seen
- September 28, 2026
- Last seen
- September 28, 2026
Posting Health
- Days active
- 0
- Repost count
- 0
- Trust Level
- 56%
- Scored at
- September 28, 2026
Signal breakdown
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