118-WW TMG MFG OPS10d ago
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Dry/Plasma Etch Process Development Engineer (SM1)
OtherProcess Development Engineer
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Quick Summary
Key Responsibilities
Process Development Develop and optimize plasma etch processes for advanced semiconductor devices. Design and execute experiments (DOE) to improve critical process metrics,
Technical Tools
OtherProcess Development Engineer
Responsibilities
~2 min read- →
Process Development
- →Develop and optimize plasma etch processes for advanced semiconductor devices.
- →Design and execute experiments (DOE) to improve critical process metrics, including:
- →Etch rate
- →Selectivity
- →Critical dimension (CD) control
- →Profile control
- →Defectivity
- →Uniformity
- →Characterize process performance and establish process windows for manufacturing robustness.
- →Evaluate new process chemistries, hardware configurations, and chamber technologies.
- →Support development and qualification of next-generation etch technologies.
- →Collaborate with device integration teams to meet product and technology requirements.
- →Drive process readiness for technology transfers from development into manufacturing.
- →Establish process specifications, control plans, and release documentation.
- →Partner with equipment engineering teams to improve tool capability, productivity, and reliability.
- →Lead chamber matching, equipment qualification, and process performance improvement activities.
- →Support installation and startup of new etch platforms.
- →Analyze complex process datasets using statistical methods and data analytics tools.
- →Identify root causes of process excursions and implement corrective actions.
- →Lead yield improvement and defect reduction initiatives.
- →Utilize SPC methodologies to monitor and improve process stability.
- →Work closely with:
- →Process Integration
- →Manufacturing
- →Yield Engineering
- →Metrology
- →Equipment Engineering
- →Quality and Reliability teams
- →Present technical findings and recommendations to management and key stakeholders.
- →Mentor junior engineers and technicians as needed.
Requirements
~1 min read- 8+ years of semiconductor plasma/dry etch process development experience.
- Bachelors in an engineering discipline
- Strong foundation in statistical process control, engineering change control and process release strategies
- Experience with DOE methodologies and statistical analysis.
- Familiarity with metrology techniques including SEM, CD-SEM, ellipsometry and defect inspection tools.
- Strong foundation in statistical process control, engineering change control and process release strategies
- Proficiency with Python, Claude, or other AI models or tools is a plus
- Demonstrated strong analytical and problem solving skills resulting in innovative and creative process solutions
- Experience with process development and transfer on etch platforms (LAM, AMAT, TEL, etc)
- Strong verbal and written communication skills
- Ability to work in teams and collaborate effectively with people in different job functions
- Strong time management skills that enable on-time project delivery
- Demonstrated ability to build strong, influential relationships
- Ability to work effectively in a fast-paced and rapidly changing environment
- Ability to take the initiative and drive for result
Location & Eligibility
Where is the job
Lenexa, United States
On-site at the office
Who can apply
US
Listing Details
- Posted
- August 21, 2026
- First seen
- August 25, 2026
- Last seen
- August 25, 2026
Posting Health
- Days active
- 0
- Repost count
- 0
- Trust Level
- 51%
- Scored at
- August 25, 2026
Signal breakdown
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External application · ~5 min on 118-WW TMG MFG OPS's site
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