Manufacturing Quality Engineer

Malaysia·Kuala Lumpurmid

OtherManufacturing Quality Engineer

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Key Responsibilities

Quality Continuous Improvement – proactively identify,

Technical Tools

OtherManufacturing Quality Engineer

~1 min read

→Quality Continuous Improvement – proactively identify, lead and execute quality improvement projects to systemically improve baseline area quality performance in achieving Zero-Defect target by structurally performing risk assessment, eliminating systemic quality risks and implementing firewall and system control.
→Automotive Quality – act as primary custodian of IATF 16949 Standards and VDA 6.3 Process Audits Requirement, ensuring all manufacturing controls are fully compliant.
→Problem Solving – leading area Quality Improvement Team (QIT) in resolving customer returns or internal quality events through comprehensive 8D methodology and data-driven root cause analysis tools (eg. 3x5 Whys, Fault Tree Analysis, Is/ Is-Not…)
→Containment & Disposition – responsible on quality event containment scoping, risk assessment, material disposition (including coordinate Material Review Board (MRB)) and production recovery.
→Quality Core Tools – Extensive knowledge and experience in APQP, PPAP, FMEA, CP, MSA & SPC
→Statistical Outlier Control – establish, maintain and optimize robust outlier detection mechanisms driving LRR and Signal-to-Noise improvements; Advanced Six Sigma analytical tools such as ANOVA, Design of Experiments (DOE) to resolve complex/ multi-variable quality issues.
→Support new product introduction (NPI) qualification by ensuring quality requirements are incorporated from beginning.

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Bachelor’s degree in Electrical/ Electronic Engineering, Mechanical Engineering, Material Science, Computer Science, Data Science or related technical discipline.
Minimum of 2 years hands-on quality and reliability engineering experience in Semiconductor Assembly & Test Manufacturing environment with strong analytical and problem-solving skills and ability to work effectively in fast-paced and rapidly changing environments
Deep practical working knowledge of IATF16949 and VDA 6.3 audit framework
Solid process knowledge of critical semiconductor process (Wafer Dicing, Die Attach, Wire Bond, Mold or Trim & Form) and associated Control Plan & Process FMEA.
Strong influencing skill in building Zero Defect quality performance
Uncompromising commitment to quality, ability in making hard decisions, challenge risk-based thinking and decision in stopping manufacturing lines when quality boundaries are at risk
Strong executive communication skills both verbal and writing with proven experience presenting technical 8D reports and risk assessments to automotive customers and company leadership.

Strong verbal and written communication skills
Demonstrated strong analytical and problem solving skills
Ability to work in teams and collaborate effectively with people in different functions
Ability to take the initiative and drive for results
Strong time management skills that enable on-time project delivery
Ability to work effectively in an interrupt-driven, fast-paced and rapidly changing environment
Demonstrated ability to build strong, influential relationships
Possess exceptional customer interface and problem solving skills
Fab Process or Product Engineering experience
Familiar with MBayse, Spotfire, 8D, Root cause analysis techniques
Experience with standard Quality Systems such as QTS, SFC, QC Story, Alerts