Process Development Engineer

• →Cross functional team leadership to support the transfer, qualification, and manufacturing of advanced analog technologies in new factories (internal and/or external to TI) to support TI growth plans and capacity needs of our customers. 
• →Coordinate the collection of all technical details needed to reproduce the technology from sending fab and arrange technical training for receiving factory. 
• →Co-own set up of the receiving fab total integrated flow.  Conduct risk assessments. Design and develop silicon plans to mitigate risks. 
• →Work with sending fab, receiving fab and ATD engineering teams to identify differences between fabs that might add risk and to establish process improvement plans to mitigate risks. Lead problem solving activities during transfer.
• →Coordinate and participate in group meetings, transfer team conference calls and management reviews. Communicate program status and key milestones to vested stakeholders.
• →Learn and drive execution of the ATD Technology Transfer methodology.
• →Coordinate with other partner organizations (planning, business teams, quality organization, technology development, characterization resources, etc.) to secure support needed to meet program schedule and success metrics.
• →Partner with technology development and manufacturing teams to develop new process technologies and components needed to support technology transfers. 

The person performing this role must be capable to plan effectively, drive schedules, meet critical deadlines on multiple tasks in parallel, lead technical discussions in their area of expertise, and work effectively across organizational boundaries. They must be able to clearly communicate project status and actions. Additionally, they must be able to interface with multiple organizations and work well on a diverse team to accomplish goals.

• Master’s degree in Electrical Engineering, Chemical Engineering, Materials Science, Physics, Mechanical Engineering, or a related engineering field
• 8 + years of Engineering experience in Wafer fabrication and related Process integration/device experience

• Ability to establish strong relationships with key stakeholders critical to success, both internally and externally
• Deep interests in semiconductor technology, a team player and a hard worker
• Strong analytical and problem-solving skills
• Strong written and verbal communication skills
• Ability to learn in a fast-paced manufacturing and technology environment
• Ability to efficiently multi-task and lead multiple high visibility projects in a fast-paced manufacturing and technology environment
• Experience in traditional wafer fab process integration skill sets
• Knowledge of semiconductor solid state physics (devices and materials).
• Sound data analysis, data-mining and other analytical skills
• Ability to quickly ramp on new systems and processes
• Demonstrated strong interpersonal, analytical and problem-solving skills
• Ability to work in teams and collaborate effectively with people in different functions
• Ability to take the initiative and drive for results
• Strong time management skills that enable on-time project delivery
• This engineer must be able to organize data and plan across various groups
• General: organized, good communicator, efficient with time, effective with others, strong sense of urgency, takes ownership
• Willing to travel within and outside US