Program Management Engineer

The Switching Regulator Wide Vin Product Line (SR-WVB) is seeking a technically skilled, energetic, competitive and results oriented leader who enjoys developing new products and technologies to market as an Engineering Program Manager (EPM) to drive new product execution success for 2026 and beyond.  

In this role you will lead new products from concept to release in partnership with leaders in the organization and support/manufacturing functions across TI. You will the opportunity to work on buck converters, controller and emerging areas such as 100V GaN process, package, IP and test for industry leading automotive, industrial, Functional Safety and Datacenter customers.  On this team, you will be a part of a professional and inclusive work environment where you are expected to achieve flawless execution goals while maintaining quality and strong working relationships.

In this role, the Program Manager will be responsible for:

• →Leading a cross functional team on the execution of releasing new products and ensuring successful return on investment for every development.   The team consists of Design, Marketing, Systems & Applications, Validation, Product & Test Engineering, Firmware/Software Engineering, Manufacturing, Field, and Quality. 
• →Working with wafer fabrication, assembly & test sites to guarantee schedule, cost and quality. 
• →Planning the project using MS Project from Assess Opportunity Phase to Release to Market and is responsible to make sure the project comes in on budget.
• →Providing clear direction to both, team and external support organizations like device fabrication and assembly & test sites. 
• →Driving and motivating all team members critical to the flawless execution of each product and project. 
• →Providing weekly and monthly updates to Senior Management on status of projects and explain the issues facing a project.  Clear communication and organizational skills are a must. 

• →Candidate will have customer interaction in support of project status, key milestones, and deliveries.  This includes samples deliveries, special work requests, wafer lot starts and reliability tests. 
• →Working with failure analysis (FA) to determine root cause of any reliability and qualification failures
• →Device packaging and wafer fabrication process knowledge is a plus or at least be willing and eager to learn these critical details needed in this role. 
• →Reliability requirements and tri-temp characterization methodology using statistical analysis knowledge is a plus or at least be willing and eager to learn these critical details needed in this role.

• Must manage multiple projects simultaneously, and set realistic plans based on required tasks with available resources.
• Ability to effectively coordinate and lead global development teams on projects that include design, silicon fabrications, production test development, qualification and production ramp. Programs will be driven out of multiple global locations. 
• Previous successful project engineering/management experience on highly complex products/projects required. 
• Proven leadership capabilities in leading multifaceted global organizations.  Successful proven track record in indirect management and influence is a must. 
• Must be able to provide clear direction to both internal teams and external support organizations like device fabrication and assembly sites. 

• Must work in a team environment and understand cross-functional team dynamics. 
• Must be capable of communicating & working with global customers to align project schedules with customers’ key milestones.
• We seek a highly motivated individual who will challenge teammates to achieve flawless execution goals, while maintaining strong working relationships.

• Thorough and up-to-date project schedules with all related milestones.
• Qualification plan development and implementation.
• Weekly management and communication on status of each project. 
• Effective coordination of material logistics and shipment/assembly/test prioritization.
• Manage and document project per TI new product development guidelines.
• Success will be measured by the ability to grow the number of new products and drive the forecasted return on investment.

• 2+  years of Project Management or Product Engineering experience
• Bachelor's degree in Electrical Engineering or related degree program

• Organizational skills are a must as this person must be able to explain to upper management the issues facing a project.  Provide regular updates to Product Line Manager on the status of projects.
• The candidate must have an overall passion for success and leading teams in product execution and most importantly “New Product Success”. 
• Knowledge of statistics and tools to analyze large amounts of characterization data and determine and set production test limits and predict yield dataHave working knowledge of what is required to take a product from development stage to production
• Strong interpersonal leadership and communications skills (both verbal and written)
• Experienced in leading cross functional teams.
• Experienced in working with assembly and wafer fabrication sites to guarantee schedule, cost and quality.
• Must be able to plan the project using MS Project from Assess Opportunity Phase to Release to Market (RTM).
• The candidate is responsible to make sure the project meets objectives, and comes in on time and budget. 
• Manage weekly new project team meetings that facilitate the development process.Must be able to use TI tools in the development process.
• The candidate must have basic understanding on packaging/ process nodes and act as a bridge among design team, process and packaging engineer.
• Familiar with TI NPDE playbook best practice
• Ideal candidate will have a proven track record of building relationships with key product development and manufacturing partners. 
• Must be flexible to work within US, European and Asian business hours
• Experience with statistical tools to analyze large amounts of data