Senior Die Bond/Die Attach Equipment Engineer

Malaysia·Kuala Lumpursenior

OtherEquipment Engineer

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Quick Summary

Key Responsibilities

Evaluating, selecting, and ordering equipment that is most appropriate and cost effective for the manufacture of company products Overseeing the installation, modification,

Requirements Summary

Minimum Education (Bachelor's degree Electrical Engineering, Electrical Computer Engineering, Chemical Engineering, Mechanical Engineering, Materials Science Engineering,

Technical Tools

OtherEquipment Engineer

Responsibilities

~1 min read

→Evaluating, selecting, and ordering equipment that is most appropriate and cost effective for the manufacture of company products
→Overseeing the installation, modification, upgrade and maintenance of manufacturing equipment
→Keeping current on equipment manufacturers' technical notices, upgrades and safety issues
→Studying equipment performance and reliability
→Establishing programs and solutions for increasing uptime and for equipment problems that affect the manufacturing process
→Providing technical support to the manufacturing equipment repair and process engineering organizations
→Defining and writing preventative maintenance schedules

Requirements

~1 min read

Minimum Education (Bachelor's degree Electrical Engineering, Electrical Computer Engineering, Chemical Engineering, Mechanical Engineering, Materials Science Engineering,) Physics or related engineering degree
Minimum of 5 years of die bond or die attach equipment hands on experiences