2mo ago

Senior Die Prep / Pre Assembly process engineer

Malaysia·Malaccasenior

EngineeringProcess Engineer

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Quick Summary

Key Responsibilities

Support manufacturing operations Develop and implement improved methods of manufacturing, procedures, and processes that result in improved efficiencies, yields, machine operations,

Requirements Summary

Minimum 5 years relevant experiences in die prep operation in semiconductor field Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering,

Technical Tools

EngineeringProcess Engineer

Responsibilities

~1 min read

→Support manufacturing operations
→Develop and implement improved methods of manufacturing, procedures, and processes that result in improved efficiencies, yields, machine operations, and quality
→Implement project or improvement plans for areas of responsibility including but not limited to: efficiency improvements, cost reduction or quality improvement programs, new product support and other process improvements
→Perform lot and equipment dispositions to support the continuous flow of production and to minimize cycle time in a high volume manufacturing 300mm wafer Fab running Analog Technologies
→Identify systematic problems in either process or equipment related sources and communicating findings to the engineering staff in a continuous manner
→Support the manufacturing ramp with execution of equipment/process startup, process experiments (SWRs)
→Participate in data analysis and problem resolution

Requirements

~1 min read

Minimum 5 years relevant experiences in die prep operation in semiconductor field
Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field
Strong foundation in statistical process control, engineering change control and process release strategies.
Knowledge in backgrind process, mechanical saw process, Laser Saw Process