Senior Packaging Development Engineer - Substrate Modules

Malaysia·Malaccasenior

Other

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Key Responsibilities

Optimizing and establishing robust and high-speed process parameters for various component attach processes, stack-up,

Technical Tools

Other

~1 min read

→Optimizing and establishing robust and high-speed process parameters for various component attach processes, stack-up, and molding (transfer or compression) technology
→Defining simplified manufacturing process sequence for different components attach
→Managing multiple new product executions starting from kick-off, product prototyping, characterization, learning cycles, and qualifications until product RTM including project documentation
→Collaborate closely with factory operations teams to meet manufacturing indices, quality standards, and cost entitlements
→Engaging with global package platform and emerging technology team to execute differentiated technology roadmaps to establish process capabilities in front of needs
→Enabling TI power modules package competitiveness through adopting the industry latest greatest capabilities in the high-volume manufacturing environment

~2 min read

Bachelor’s degree in Mechanical Engineering, Physics, Material Science, or a related field of study
Cumulative > 3.3 CGPA and above
Minimum 5 years' experience in the manufacturing semiconductor field
Hands on skills in operating machines and knowledge to down-select material, process optimization and yield improvement

Package layer design expertise such as structural configuration, material selection and process flow design
Ability to engage with a geographically diverse team with a strategic vision to drive a complex technology roadmap.
Hands on experience on system-in-Package (SiP), including exposed Inductor integration solutions is added advantage.
Knowledge of power module packaging processes, including understanding of Design for Manufacturability (DFM) constraints and module package defect criteria.
Experience in multi-process coordination and optimization (integration between SMT and back-end packaging processes)
Ability to establish strong and collaborative relationships with stakeholders, global design & manufacturing teams and component/material/substrate supplier to meet on-time execution
Broad and deep technical understanding of PCB / Substrate / Laminate / MIS manufacturing.
Knowledge in FMEA methodology, process control plan, statistical analysis, SPC and DOE methodology. Skilled in JMP statistical analysis software is an added advantage
Experience with assembly of power modules packaging, substrate design and reliability requirements
Project management experience in semiconductor industry specifically in Assembly Test or SMT Operation
Key personal characters – trustworthy, inclusive, innovative, competitive, result-oriented