Wire Bond & Die Attach Equipment Engineer (MES Project)

MalaysiaMalaysia·Kuala Lumpurmid
OtherEquipment Engineer
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Quick Summary

Key Responsibilities

MES Implementation (Project Phase): Represent equipment engineering in the MES rollout. Define equipment-specific workflows, setup/recipe controls,

Requirements Summary

Translate physical shop-floor requirements into digital process designs. Define data collection needs and equipment interlocks to ensure seamless hardware-to-software communication.

Technical Tools
OtherEquipment Engineer

Join TI as a specialized Equipment Engineer to drive the digital transformation of our Wire Bond and Die Attach lines. This is a unique, multi-phase role: following a 1 month TI orientation familiarizing with TI systems while being deployed into a critical MES implementation project team for 1–2 years. Upon successful project completion, you will transition into a production role, utilizing your deep MES expertise to optimize equipment uptime and automation in a high-volume manufacturing environment.

Responsibilities

~1 min read
  • →MES Implementation (Project Phase): Represent equipment engineering in the MES rollout. Define equipment-specific workflows, setup/recipe controls, qualification requirements, and equipment states.
  • →Integration & Data: Translate physical shop-floor requirements into digital process designs. Define data collection needs and equipment interlocks to ensure seamless hardware-to-software communication.
  • →Validation: Validate equipment integration scenarios and lead User Acceptance Testing (UAT) and deployment on the production floor.
  • →Sustaining (Post-Project Phase): Transition to a production role to manage equipment reliability, troubleshoot MES-related equipment issues, and leverage your implementation knowledge to drive continuous improvement in automation and uptime.

Requirements

~1 min read
  • Minimum Education (Bachelor's degree Electrical Engineering, Electrical Computer Engineering, Chemical Engineering, Mechanical Engineering, Materials Science Engineering,) Physics or related engineering degree
  • Strong hands-on semiconductor equipment experience in Wire Bond and/or Die Attach, with minimum 2 years of relevant experience 
  • Equipment experience with ASM and KNS
  • Candidate with MES experiences
  • Experience on tool monitoring and interdiction software, and equipment maintenance and documentation
  • Working knowledge of semiconductor manufacturing, and SPC techniques. Experienced with semiconductor cleanroom protocol and behaviors.
  • Strong verbal and written communication skills
  • Demonstrated strong analytical, critical thinking and problem solving skills
  • Ability to work in teams and collaborate effectively with people in different functions
  • Ability to take the initiative and drive for results
  • Strong time management skills that enable on-time project delivery
  • Ability to work effectively in an interrupt-driven, fast-paced and rapidly changing environment
  • Demonstrated ability to build strong, influential relationship

Location & Eligibility

Where is the job
Kuala Lumpur, Malaysia
On-site at the office
Who can apply
MY

Listing Details

Posted
September 28, 2026
First seen
September 28, 2026
Last seen
September 28, 2026

Posting Health

Days active
0
Repost count
0
Trust Level
56%
Scored at
September 28, 2026

Signal breakdown

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Wire Bond & Die Attach Equipment Engineer (MES Project)