9mo ago

Digital - Principal Systems/DSP Engineer

San FranciscoFull-timelead

OtherDsp Engineer

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Overview

Join the leading chiplet startup! As the Principal Systems/DSP Engineer at Eliyan, you will define and drive the DSP architecture for next-generation 224G and 448G SerDes designs powering tomorrow’s chiplet-based systems with best-in-class power, area, manufacturability, and design flexibility.

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Join the leading chiplet startup! As the Principal Systems/DSP Engineer at Eliyan, you will define and drive the DSP architecture for next-generation 224G and 448G SerDes designs powering tomorrow’s chiplet-based systems with best-in-class power, area, manufacturability, and design flexibility. You will own the end-to-end system modeling, equalization algorithm development, and CDR architecture for industry-leading SerDes IPs implemented on advanced 3nm/2nm process nodes. You will work with a cross-functional team of experts that operate from first principles, innovate and push the envelope to create high-volume and high-performance manufacturable products. We offer a fun work environment with excellent benefits

Define and architect low-power DSP architectures for 224G PAM4 and 448G SerDes designs, driving key trade-offs between power, performance, and area

Develop and maintain behavioral models of mixed-signal transceiver circuits using MATLAB, Simulink, C, and/or Python for system-level performance prediction and design specification

Develop, evaluate, and optimize equalization algorithms including FFE, DFE, CTLE, and MLSE/MLSD for 224G/448G channel loss and impairment compensation

Derive and specify analog front-end (AFE), DAC/ADC, and PLL performance targets from system-level BER and link budget analyses

Design and optimize adaptive DSP algorithms for channel compensation, including adaptation convergence strategies, calibration sequencing, and robustness across PVT corners

Architect and evaluate clock and data recovery (CDR) algorithms and loop dynamics, including jitter tolerance analysis, bang-bang and linear CDR trade-offs, and frequency acquisition strategies

Perform system-level simulations and trade-off analyses balancing power consumption (digital and analog), performance, and BER requirements

Collaborate closely with analog, digital RTL, and physical design teams to ensure algorithm-to-implementation fidelity and power-efficient silicon realization

Develop and evaluate FEC solutions including inner/outer FEC architectures, RS-FEC (KP4/KP8) integration, and concatenated coding schemes per IEEE 802.3dj and OIF CEI-224G standards

Drive silicon bring-up and characterization test plans, correlating pre-silicon system models with post-silicon measurements to validate DSP performance

Define lab validation methodologies and work with characterization teams on silicon debug, performance benchmarking, and standard compliance testing

Provide technical leadership to customers and partners on system-level link performance, interoperability, and algorithmic optimization

Masters or Ph.D in Electrical Engineering, Computer Engineering, or related fields

10+ years of experience in DSP system architecture and algorithm development for high-speed serial communication systems, with hands-on work at 112G PAM4 or higher data rates

Deep expertise in digital communication and signal processing theory, including PAM4 modulation, equalization architectures, CDR loop dynamics, and statistical channel modeling

Expert-level proficiency in system modeling using MATLAB, Simulink, C, and/or Python with demonstrated ability to build production-quality behavioral models

Strong working knowledge of high-speed serial protocols and standards including Ethernet (IEEE 802.3ck/df/dj), PCIe, UCIe, and OIF CEI specifications

Solid understanding of mixed-signal circuit design concepts (DAC/ADC architectures, PLL phase noise, AFE linearity) and their impact on DSP algorithm performance and link budget

Proven ability to collaborate across analog, digital, and verification teams to translate algorithmic intent into silicon-ready implementations

Hands-on experience with 112G/224G SerDes products with proven tapeout or silicon characterization results

Detailed knowledge of OIF CEI-224G and IEEE 802.3dj standards including link budget allocation, compliance test methodologies, and FEC performance metrics

Experience with chiplet D2D interconnects, optical/electrical interfaces (VCSEL, EML), or DRAM/HBM PHY systems a plus