Eliyan3mo ago

PD - IP Lead – Sr Staff, Physical Design

San FranciscoFull-timesenior

OtherLeadPhysical Design Engineer

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Overview

Technical Tools

OtherLeadPhysical Design Engineer

Join the leading chiplet startup! As an Eliyan Sr Staff / Principal Physical Design Engineer, you will be working at a fast-paced early-stage startup creating technologies that fuel tomorrow’s chiplet based systems with best-in-class power, area, manufacturability, and design flexibility. You will drive the development of cutting-edge ASICs from RTL to GDSII. You will work with a cross-functional team of industry experts that operate from first principles, innovate, and push the envelope to create high-volume and high-performance manufacturable products. In this role, you will oversee and optimize the entire design flow, including synthesis, place-and-route (PNR), static timing analysis (STA), electromigration/IR drop analysis (EM/IR), and physical verification (PV – DRC, LVS, Antenna). You will also focus on developing and improving design flows and methodologies to ensure high-quality, on-time delivery. We offer a fun work environment with excellent benefits.

Define and execute IP block and partition physical design strategy across projects, aligning schedules, resources, and milestones to company tapeout goals.

Lead mixed signal placement and routing, enforcing analog keepouts, shielding, and DRC aware methodologies while integrating digital logic cleanly.

Own system and block integration for floorplanning, power, placement, CTS, and constraints, ensuring consistent interfaces across hierarchy and reuse

Drive end to end IP physical implementation from RTL handoff through GDSII, managing iterations, ECOs, and closure plans across corners

Develop and maintain block specific flow customizations for synthesis, PNR, EM IR, STA, and physical verification to improve QoR and predictability

Deliver robust constraints methodology, pushing timing intent from system to block and back, maintaining mode and corner correctness for signoff

Run and close subsystem signoff including STA, EM IR, SI, DRC, LVS, antenna, and metal fill, meeting reliability and manufacturability requirements

Optimize clock architecture and CTS for skew, latency, and power, including skew group definitions and balancing across library corners

Collaborate with front end, DFT, packaging, and manufacturing to resolve integration risks, test mode impacts, and physical interface requirements

Provide clear status, risk, and mitigation reporting to leadership, using metrics driven dashboards for PPA, convergence, and schedule predictability

Expertise in physical design, timing closure, and signoff for small to large ASIC IP blocks, including mixed signal integration and subsystem closure ownership

Strong hands-on experience with floorplanning, power planning, placement, CTS, routing, EM IR, STA, and PV signoff across MMMC scenarios

Proven ability to improve flows through automation and scripting, with disciplined debug skills and data driven QoR and runtime optimization mindset

Excellent cross functional leadership and communication skills to drive alignment, technical reviews, and closure decisions under aggressive timelines