RFIC Thermal Engineer
Quick Summary
Develop thermal models for RFIC devices, packages, and modules to evaluate heat dissipation and temperature distribution.
Experience with thermal simulation tools such as ANSYS, COMSOL, or similar platforms. Fa
Are you passionate about solving complex thermal challenges in advanced semiconductor technologies? At Falcomm, we are transforming innovative semiconductor research into real-world solutions through high-performance, energy-efficient RF power amplifier technologies. Our mission is to deliver next-generation wireless solutions that maximize performance while improving efficiency and reliability.
Falcomm is seeking an RFIC Thermal Engineer to analyze, model, and optimize thermal performance in RF integrated circuits and semiconductor packages. This role will focus on understanding heat dissipation, thermal reliability, and thermal management strategies for high-power RF devices. The position requires collaboration with RFIC designers, packaging engineers, and system teams to ensure devices operate reliably under demanding performance conditions.
Responsibilities
~1 min read- →Develop thermal models for RFIC devices, packages, and modules to evaluate heat dissipation and temperature distribution.
- →Perform thermal simulations and analysis to support design optimization and reliability improvements.
- →Collaborate with RFIC design and packaging teams to develop thermal management strategies.
- →Evaluate thermal performance across different packaging technologies and materials.
- →Support silicon validation and characterization related to thermal performance.
- →Analyze thermal failure mechanisms and recommend design or process improvements.
- →Document analysis methods, results, and recommendations.
Requirements
~1 min read- Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, or a related discipline.
- 3-5 years experience with thermal analysis, modeling, or simulation in semiconductor or electronic systems.
- Strong understanding of heat transfer principles and thermal management techniques for RFICs and MMICs.
- Must be willing to work full-time, onsite, in Atlanta, GA.
Nice to Have
~1 min read- Experience with thermal simulation tools such as ANSYS, COMSOL, or similar platforms.
- Familiarity with semiconductor packaging technologies and thermal interface materials.
- Experience analyzing high-power devices such as RF amplifiers or high-frequency ICs.
- Strong analytical and problem-solving skills with the ability to collaborate across engineering teams.
What We Offer
~1 min readLocation & Eligibility
Listing Details
- Posted
- March 12, 2026
- First seen
- September 28, 2026
- Last seen
- September 28, 2026
Posting Health
- Days active
- 0
- Repost count
- 0
- Trust Level
- 16%
- Scored at
- September 28, 2026
Signal breakdown
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