Quick Summary
- Collaborate with the engineering team to develop solutions in our manufacturing operation using AI, IIOT, Smart vision system and/or other automation solutions.
- Practical work with on very high speed/high precision die attach equipment, wire bonder, chip attach, high precision over-mold tool and other semiconductor packaging tools in High Volume manufacturing environment.
- Participates in concurrent projects on current production, sustainability and New Product Introduction.
- Work alongside an aspiring team of Engineering and Operation executives to build smart factory solutions to future-proof the manufacturing quality of our supplies.
- Innovates, develops and defines improved manufacturing processes through methodical approach and studies.
- Master or Bachelor’s degree in Mechanical, Manufacturing, Automation, Computer Engineering, Data Science/Analytics/AI or any related field.
- Able to commit for a 5-6 months full time internship, starting in January 2027.
- A willingness to learn and the ability to communicate ideas clearly in a team.
- Strong ability to work as team and as individual.
- Practical and smart thinking to turn a typical MNC operations into an exciting workplace through implementation of smart technology.
- Applied Skill with Power BI, Power Automate and/or Robotic Process Automation would be an advantage.
- Good knowledge and applied skills in AI, IIOT, digitalization, Machine Learning and/or software programming skills would be an added advantage.
Sustainable impact is HP’s commitment to create positive, lasting change for the planet, its people, and our communities. This serves as a guiding principle for delivering on our corporate vision – to create technology that makes life better for everyone, everywhere.
HP is a Human Capital Partner – we commit to human capital development and adopting progressive workplace practices in Singapore.
#Li-Post
HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).
Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.
For more information, review HP’s EEO Policy or read about your rights as an applicant under the law here: “Know Your Rights: Workplace Discrimination is Illegal"
Location & Eligibility
About this job
- Who can apply
- Singapore
- Posted
- Today
Listing Details
- Posted
- October 27, 2026
- First seen
- October 27, 2026
- Last seen
- October 27, 2026
Posting Health
- Days active
- 0
- Repost count
- 0
- Trust Level
- 56%
- Scored at
- October 27, 2026
Signal breakdown
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