1mo ago

Die Prep Module Engineer (Contract Role)

MalaysiaMalaysia·Kulimmid
OtherEngineer
1 views0 saves0 applied

Quick Summary

Requirements Summary

Bachelor/Master Degree in Electrical / Electronics / Mechanical/ Mechatronics and Materials Engineering with minimum 2 years of work experience. Fresh graduate is welcome to apply.

Technical Tools
OtherEngineer

Responsibilities

~1 min read
  • →Process Optimization - Own, stabilize, and optimize pick and place, PnP process parameters, drive systematic yield improvement, and resolve process integration issues.
  • →Equipment Engineering - Lead complex troubleshooting, preventive/corrective maintenance strategies, and collaborate with tool vendors to upgrade hardware/software.
  • →Data and Yield Analysis - Utilize Statistical Process Control, SPC, Design of Experiments, DOE, and Failure Mode and Effects Analysis, FMEA to identify root causes of process drift or hardware failures.
  • →Cross-Functional Collaboration - Partner with upstream/downstream process owners and research and development teams to seamlessly transfer and ramp new products, NPI.
  • →Documentation and Standards - Standardize operating procedures - SOPs, document troubleshooting guides, and present technical findings/progress updates directly to factory stakeholders.

Requirements

~1 min read
  • Bachelor/Master Degree in Electrical / Electronics / Mechanical/ Mechatronics and Materials Engineering with minimum 2 years of work experience.
  • Fresh graduate is welcome to apply.
  • Good knowledge experience in semiconductor back-end assembly, specifically within Die Preparation and pick and place, PnP processes will be an added advantage.
  • Basic understanding of Statistical Process Control, SPC, statistical data analysis, and structured problem-solving methodologies. Expertise in Design of Experiments, DOE, Failure Mode and Effects Analysis, FMEA, and Root Cause Analysis, RCA will be an added advantage.
  • Good communication skills with the ability to collaborate in cross-functional team environments and present technical data clearly.

          

Intel Contract Employee

Shift 1 (Malaysia)

Malaysia, Kulim

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
N/A

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Location & Eligibility

Where is the job
Kulim, Malaysia
On-site at the office
Who can apply
MY

Listing Details

Posted
September 3, 2026
First seen
September 30, 2026
Last seen
October 8, 2026

Posting Health

Days active
9
Repost count
0
Trust Level
19%
Scored at
October 9, 2026

Signal breakdown

freshnesssource trustcontent trustemployer trust
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Die Prep Module Engineer (Contract Role)