Quick Summary
Minimum Qualifications Bachelor's degree with 6+ years of experience, OR Master's degree with 4+ years of experience, OR PhD with 2+ years of experience in Mechanical Engineeri
The Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization is responsible for developing cutting edge substrate packaging and wafer assembly solutions for our customers. As a member of the Substrate Technology Integration Group, you will play a critical role in enabling advanced packaging technology developments.
In this position, you will lead EMIB-T substrate technology development and qualification activities, ensuring suppliers achieve the required readiness to support growing customer demand. This includes driving technical enablement, managing readiness milestones, and collaborating closely with cross functional engineering teams, suppliers, and assembly platform partners
Requirements
~1 min readBachelor's degree with 6+ years of experience, OR Master's degree with 4+ years of experience, OR PhD with 2+ years of experience in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, Physics, or a related technical field.
A strong foundation in advanced packaging, substrates, or semiconductor manufacturing; proven leadership in supplier management or technology enablement; and the ability to drive alignment and execution across global teams.
Proven ability to thrive in high-ambiguity environments and deliver results under pressure. Knowledge of advanced packaging technologies and substrate/assembly manufacturing methodologies.
Familiarity with characterization techniques such as X-ray, SEM, FTIR, and EDX.
Experience with process flow development, FMEA, DOE design, and problem-solving tools.
Statistical tools and methods, including Statistical Process Control (SPC) for yield improvement
Experience managing complex projects and deliver results in TD/high-volume manufacturing environments.
What We Offer
~1 min readWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $89,010.00-170,630.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Location & Eligibility
Listing Details
- Posted
- August 31, 2026
- First seen
- September 30, 2026
- Last seen
- September 30, 2026
Posting Health
- Days active
- 0
- Repost count
- 0
- Trust Level
- 18%
- Scored at
- September 30, 2026
Signal breakdown
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