Module Engineering - Day Shift 5 or 7

• Design and develop assembly processes and equipment, applying novel engineering concepts to advance Intel's foundry packaging roadmap and platform technologies.
• Optimize manufacturing efficiency for foundry packages, developing processes that meet rigorous quality, reliability, cost, yield, productivity, and manufacturability requirements specific to foundry customer needs.
• Define process and equipment specifications using Design of Experiments (DOE) and data analysis principles, documenting innovations and improvements through technical white papers.
• Develop and maintain equipment used to evaluate silicon and package technologies under simulated field conditions, including thermal cycling, heat, humidity, and dynamic mechanical stress testing.
• Ensure physical package designs are manufacturable within foundry process flows, and oversee the full cycle of package manufacturing processes, procedures, and production flows.
• Establish material specifications for contract assemblers and raw material vendors, partnering closely with supplier quality and procurement teams to enforce process compliance and vendor performance standards.
• Create new reliability screening techniques, acceleration methods, and quality tools to enable early detection of potential packaging quality and reliability risks within the foundry manufacturing environment.
• Define reliability requirements aligned to foundry customer needs, and influence design decisions, material selection, and process development based on a fundamental understanding of failure mechanisms.
• Lead continuous improvement initiatives using statistical methods and experimental design to innovate, troubleshoot, and enhance equipment and process performance.
• Serve as a technical resource for foundry packaging challenges, responding to customer and partner requests and providing consultation on process improvements.
• Drive standardization across product qualification frameworks, manufacturing quality systems, and methodologies, while actively engaging with packaging technology development and partner engineering teams to assess process maturity and mitigate risks to key product milestones.

The Minimum qualifications are required to be initially considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

• US Citizenship required.
• Bachelor's degree with 1+ years of experiencein one of the following fields: Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or in a STEM related field of study.

-OR-

• Master's degreein Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or in a STEM related field of study.
• 6+ months of experience withStatistical Process Control (SPC)and/orDesign of Experiments (DOE)principles.

• Prior experience working in atechnology or semiconductor manufacturing environment.
• Experience in semiconductor packaging processes, including assembly, materials, or reliability engineering within a foundry context.

Intel's Foundry Technology Manufacturing business unit is at the forefront of delivering advanced packaging solutions for a broad ecosystem of customers. You will collaborate with world-class engineers, contribute to cutting-edge technology development, and directly impact the quality and performance of products that power the global technology industry. This is your opportunity to grow your career while helping define the future of foundry manufacturing.

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