Packaging Module Development Engineer

The Role and Impact
Join Intel's Packaging Module Development team and contribute to advancing assembly and packaging technologies critical to Intel's next-generation products. As a Packaging Module Development Engineer, you will design and optimize innovative processes and equipment that enhance manufacturing efficiency, product reliability, and quality. You will play a key role in shaping Intel's technology roadmap by solving complex engineering challenges and delivering industry-leading advancements in packaging solutions.

Business group
Intel's Packaging Module Development team focuses on developing cutting-edge assembly and packaging solutions that enable world-class technologies across Intel's diverse product portfolio. This group collaborates with cross-functional teams to optimize manufacturing processes, ensure product reliability, and contribute to Intel's broader mission of driving innovation and technology leadership.

Key Responsibilities
- Develop and optimize assembly processes and equipment to achieve quality, reliability, cost, yield, productivity, and manufacturability goals.
- Apply Design of Experiments (DOE) principles and statistical methodologies to refine processes and specifications, documenting improvements through technical reports.
- Design and maintain equipment to evaluate silicon and packaging technologies under simulated field conditions, including heat, humidity, temperature cycles, and dynamic forces.
- Ensure manufacturability of physical layouts in package design and oversee the lifecycle of manufacturing workflows.
- Define material specifications and collaborate with supply chain and vendor quality teams to ensure adherence to performance requirements and standards.
- Innovate new techniques, tools, and quality screens to proactively identify and address packaging reliability challenges.
- Set reliability benchmarks based on a deep understanding of failure mechanisms, ensuring customer needs are met.
- Lead initiatives to solve technical problems and drive continuous improvements across processes and equipment.
- Provide technical consultation and collaborate with internal teams and partners to address packaging challenges.
- Standardize equipment qualification practices and manufacturing quality systems to align with product milestones and mitigate technical risks.

You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications

• Bachelor's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or a related field with 1+ years of relevant experience or Master's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or a related field.
• Experience listed above should be a combination of the following:
  • Familiarity with equipment adjustment, process characterization, and manufacturability or electronics assembly.

Preferred Qualifications

• Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.

• Hands-on experience in a technology manufacturing environment or semiconductor packaging processes.
• Demonstrated ability to collaborate with cross-functional teams and contribute to time-sensitive projects.

We invite you to apply and bring your expertise, creativity, and passion for innovation to Intel. Be a part of our mission to create world-class packaging solutions and help shape the future of technology.

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