Packaging Module Development Engineer
United States·PhoenixmidOtherDevelopment Engineer
0 views0 saves0 applied
Quick Summary
Requirements Summary
You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes,
Technical Tools
OtherDevelopment Engineer
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing.
Responsibilities
~1 min readRequirements
~1 min readWhat We Offer
~1 min readThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Location & Eligibility
Where is the job
Phoenix, United States
On-site at the office
Who can apply
Open to applicants worldwide
Listing Details
- First seen
- September 30, 2026
- Last seen
- September 30, 2026
Posting Health
- Days active
- 0
- Repost count
- 0
- Trust Level
- 56%
- Scored at
- September 30, 2026
Signal breakdown
freshnesssource trustcontent trustemployer trust
External application
Newsletter
Stay ahead of the market
Get the latest job openings, salary trends, and hiring insights delivered to your inbox every week.
A
B
C
D
No spam. Unsubscribe at any time.